Skip to main content
Log in

Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology

  • Commentary
  • Lead-Free Solder
  • Published:
JOM Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

References

  1. “Directive 2002/95/EC,” Official Journal of European Union (13 February 2003).

  2. K.N. Tu, Phys. Rev., B49 (1994), p. 2030.

    Google Scholar 

  3. K. Zeng and K.N. Tu, Mater. Sci. & Eng., R38 (2002), p. 55.

    CAS  Google Scholar 

  4. C.E. Ho et al., J. Electron. Mater., 35 (2006), p. 1017.

    Article  CAS  Google Scholar 

  5. C.E. Ho, S.C. Yang, and C.R. Kao, J. Mater. Sci.-Mater. El, 18 (2007), p. 155.

    Article  CAS  Google Scholar 

  6. S.C. Yang et al., J. Appl. Phys., 101 (2007), p. 084911.

  7. Y.S. Lai, P.F. Yang, and C.L. Yeh, Microelectron. Reliab., 46 (2006), p. 645.

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Additional information

and is the advisor to JOM and chair for the Electronic Packaging and Interconnection Materials Committee of the TMS Electronic, Magnetic & Photonic Materials Division.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Kao, C.R. Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology. JOM 60, 60 (2008). https://doi.org/10.1007/s11837-008-0073-4

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11837-008-0073-4

Keywords

Navigation