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and is the advisor to JOM and chair for the Electronic Packaging and Interconnection Materials Committee of the TMS Electronic, Magnetic & Photonic Materials Division.
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Kao, C.R. Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology. JOM 60, 60 (2008). https://doi.org/10.1007/s11837-008-0073-4
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DOI: https://doi.org/10.1007/s11837-008-0073-4