Temperature Dependence of Epitaxial Graphene Formation on SiC(0001) LuxmiShu NieYugang Sun OriginalPaper Open access 21 October 2008 Pages: 718 - 724
Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity Shriram ShivaramanM. V. S. ChandrashekharMichael G. Spencer OriginalPaper 21 April 2009 Pages: 725 - 730
Growth of Graphene-Like Structures on an Oxidized SiC Surface Weijie LuW.C. MitchelL.C. Feldman OriginalPaper 28 February 2009 Pages: 731 - 736
Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process S. HoustonG. J. BrownA. Smetana OriginalPaper 21 February 2009 Pages: 737 - 741
A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis A. ArunP. SaletA. M. Ionescu OriginalPaper 14 April 2009 Pages: 742 - 749
Field Emission and Electric Discharge of Nanocrystalline Diamond Films Bohr-Ran HuangShyankay JouMeng-Chang wu OriginalPaper 18 February 2009 Pages: 750 - 755
Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures Hisashi MasuiSamantha C. CruzSteven P. DenBaars OriginalPaper Open access 10 April 2009 Pages: 756 - 760
Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes Jiun Pyng YouNguyen T. TranFrank G. Shi OriginalPaper Open access 03 April 2009 Pages: 761 - 766
Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon Bau-Ming WangYewchung Sermon Wu OriginalPaper 28 March 2009 Pages: 767 - 771
Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing T. N. OderT. L. SungT. Isaacs-Smith OriginalPaper 12 March 2009 Pages: 772 - 777
Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization Venmathy RajarathinamC. Hunter LightseyPaul A. Kohl OriginalPaper 19 March 2009 Pages: 778 - 786
Growth and Characterization of Zn-Incorporated Copper Oxide Films M. EnginF. AtayI. Akyuz OriginalPaper 05 March 2009 Pages: 787 - 796
Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides D. WolanskyP. Zaumseil OriginalPaper 21 April 2009 Pages: 797 - 801
Microstructure Evolution and the Constitutive Relations of High-Temperature Solders Harry SchoellerShubhra BansalJunghyun Cho OriginalPaper 31 March 2009 Pages: 802 - 809
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Ping-Feng YangSheng-Rui JianRong-Sheng Chen OriginalPaper 31 March 2009 Pages: 810 - 814
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics Weiqiang WangAnupam ChoubeyMichael Pecht OriginalPaper 14 April 2009 Pages: 815 - 827
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders N. ZhaoX.M. PanL. Wang OriginalPaper 14 April 2009 Pages: 828 - 833
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability Wan Ho SongChunjin HangJohn Persic OriginalPaper 03 April 2009 Pages: 834 - 842
Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C Olli NousiainenTero KangasvieriJouko Vähäkangas OriginalPaper 14 April 2009 Pages: 843 - 851
Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints Q. K. ZhangH. F. ZouZ. F. Zhang OriginalPaper 10 April 2009 Pages: 852 - 859
Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint Fengshun WuBo WangYiping Wu OriginalPaper 05 March 2009 Pages: 860 - 865
Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study Wei ZhouLijuan LiuPing Wu OriginalPaper 03 April 2009 Pages: 866 - 872
Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates Seongjun KimKeun-Soo KimGoro Izuta OriginalPaper 10 April 2009 Pages: 873 - 883
High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies E.H. WongS.K.W. SeahC.-L. Yeh OriginalPaper 09 April 2009 Pages: 884 - 895
Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment Sun Sik KimKeun Soo KimKatsuaki Suganuma OriginalPaper 19 March 2009 Pages: 896 - 901
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes Bo-In NohJeong-Won YoonSeung-Boo Jung OriginalPaper 10 March 2009 Pages: 902 - 907
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board Chi-pu LinChih-ming Chen OriginalPaper 21 April 2009 Pages: 908 - 914