Chemical vapor deposition synthesis of self-aligned carbon nanotube arrays Stephan P. TuranoJud Ready OriginalPaper Pages: 192 - 194
A rapid growth of aligned carbon nanotube films and high-aspect-ratio arrays Lingbo ZhuJianwen XuC. P. Wong OriginalPaper Pages: 195 - 199
Indium and tin oxide nanowires by vapor-liquid-solid growth technique Pho NguyenSreeram VaddirajuM. Meyyappan OriginalPaper Pages: 200 - 206
Molecular dynamics study of bamboo-like carbon nanotube nucleation Feng DingKim BoltonArne Rosén OriginalPaper Pages: 207 - 210
Synthesis optimization and characterization of multiwalled carbon nanotubes Christian P. DeckGregg S. B. McKeeKenneth S. Vecchio OriginalPaper Pages: 211 - 223
Effect of the fabrication method on the electrical properties of poly(acrylonitrile-co-butadiene-co-styrene)/carbon black composites Sidhartha GuptaRunqing OuRosario A. Gerhardt OriginalPaper Pages: 224 - 229
Bonding parameters of blanket copper wafer bonding K. N. ChenA. FanR. Reif OriginalPaper Pages: 230 - 234
A diameter-selective chiral separation of single-wall carbon nanotubes using nitronium lons Kay Hyeok AnChol-Min YangYoung Hee Lee OriginalPaper Pages: 235 - 242
Optimization of active region for 1.3-µm GalnAsP compressive-strain multiple-quantum-well ridge waveguide laser diodes Po-Hsun LeiChyi-Dar YangWen-Jeng Ho OriginalPaper Pages: 243 - 249
Reliability of lead-free interconnections under consecutive thermal and mechanical loadings T. T. MattilaJ. K. Kivilahti OriginalPaper Pages: 250 - 256
Developing an analytic methodology to accurately predict probing depth in integrated circuit structures K. M. ChenK. N. Chiang OriginalPaper Pages: 257 - 265
A comparative study of metamorphic InP/InGaAs double heterojunction bipolar transistors with InP and InAIP buffer layers grown by molecular beam epitaxy Yongkun SinNathan PresserPaul Adams OriginalPaper Pages: 266 - 272
Electroless nickel/gold bump in the flip-chip-type CMOS package for mobile-phone camera modules Joong-Do Kim OriginalPaper Pages: 273 - 278
Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects Yeau Ren JengSang Mao Chiu OriginalPaper Pages: 279 - 283
Lead contamination of a transient liquid-phase-processed Sn-Bi lead-free solder paste M. WhitneyS. F. Corbin OriginalPaper Pages: 284 - 291
Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder Chin-Kuang LinChun-Ming Huang OriginalPaper Pages: 292 - 301
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes T. H. ChuangS. F. YenM. D. Cheng OriginalPaper Pages: 302 - 309
Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish Tung-Han ChuangShiu-Fang YenHui-Min Wu OriginalPaper Pages: 310 - 318
Influence of Mn incorporation on MBE growth of (In,Mn)N Gan FengMasahiro Yoshimoto OriginalPaper Pages: 319 - 322
Solid-state reaction in an Au wire connection with an Al-Cu pad during aging Guh-Yaw JangJenq-Gong DuhDavid Su OriginalPaper Pages: 323 - 332
Characterization technique in phase distribution during sample preparation for applications to solder joints and wire-bonding chips Hung-Kai ChenShih-Hai LiJenq-Gong Duh OriginalPaper Pages: 333 - 342
Phase distribution and phase analysis in Cu6Sn5, Ni3Sn4, and the Sn-rich corner in the ternary Sn-Cu-Ni isotherm at 240°C Chia-Ying LiGuo-Jyun ChiouJenq-Gong Duh OriginalPaper Pages: 343 - 352
Study of wetting reaction between eutectic AuSn and Au foil Y. T. LaiC. Y. Liu OriginalPaper Pages: 353 - 359
Effects of annealing on the thermoelectric and microstructural properties of deformed n-type Bi2Te3-based compounds D. M. LeeC. H. LimC. H. Lee OriginalPaper Pages: 360 - 365
Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples C. W. ChangQ. P. LeeC. R. Kao OriginalPaper Pages: 366 - 371
Effects of strain rates and biaxial stress conditions on plastic yielding and flow stress of solder alloys J. LiangN. DariavachZ. Fang OriginalPaper Pages: 372 - 379