Overview
- Describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs
- Features sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs
- Provides full details of all key algorithms, for maximum understanding and utility
- Includes design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process
- Includes supplementary material: sn.pub/extras
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Table of contents (20 chapters)
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High Performance and Low Power 3D IC Designs
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Electrical Reliability in 3D IC Designs
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Thermal Reliability in 3D IC Designs
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Mechanical Reliability in 3D IC Designs
Keywords
About this book
Authors and Affiliations
Bibliographic Information
Book Title: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Authors: Sung Kyu Lim
DOI: https://doi.org/10.1007/978-1-4419-9542-1
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media New York 2013
Hardcover ISBN: 978-1-4419-9541-4Published: 25 November 2012
Softcover ISBN: 978-1-4899-8696-2Published: 16 December 2014
eBook ISBN: 978-1-4419-9542-1Published: 27 November 2012
Edition Number: 1
Number of Pages: XXVIII, 560
Topics: Circuits and Systems, Nanotechnology and Microengineering, Processor Architectures