Skip to main content
SpringerLink
Log in

The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

In this study, we used microstructure evolution and electron microprobe analysis (EPMA) to investigate the interfacial reactions in Sn-Zn and Sn-Zn-Al solder balls with Au/Ni surface finish ball-grid-array (BGA) bond pad over a period of isothermal aging at 150°C. During reflow, Au dissolved into the solder balls and reacted with Zn to form γ-Au3Zn7 and γ2-AuZn3. As aging progressed, γ and γ2 transformed into γ3-AuZn4. Finally, Zn precipitated out next to γ3-AuZn4. The Zn reacted with the Ni layer to form Ni5Zn21. A thin layer (Al, Au, Zn) intermetallic compound (IMC) formed at the interface of the Sn-Zn-Al solder balls, inhibiting the reaction of Ni with Zn. Even after 50 days of aging, no Ni5Zn21 was observed. Instead, fine (Al, Au, Zn) particles similar to Al2 (Au, Zn) in composition formed and remained stable in the solder. The lower ball shear strength corresponded with the brittle fracture morphology in Sn-Zn-Al solder ball samples.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. K. Zeng and K.N. Tu, J. Mater. Sci. Eng. Rep. 38, 55 (2002).

    Article  Google Scholar 

  2. A. Zribi, A. Clark, L. Zavalij, P. Borgesen, and E.J. Cotts, J. Electron. Mater. 30, 1157 (2001).

    Article  CAS  Google Scholar 

  3. L.C. Shiau, C.E. Ho, and C.R. Kao, Soldering Surface Mount Technol. 14, 25 (2002).

    Article  CAS  Google Scholar 

  4. M.N. Ahemd Sharif, Mater. Sci. Eng., B 113, 184 (2004).

    Article  CAS  Google Scholar 

  5. K.S. Kim, S.H. Huh, and K. Suganuma, Des. Issues 352, 226 (2003).

    CAS  Google Scholar 

  6. K.S. Kim, K.W. Ryu, C.H. Yu, and J.M. Kim, Microelectron. Reliability 45, 647 (2005).

    Article  CAS  Google Scholar 

  7. K.S. Kim, J.M. Yang, C.H. Yu, I.O. Jung, and H.H. Kim, J. Alloys Compounds 379, 314 (2004).

    Article  CAS  Google Scholar 

  8. M. Date, K.N. Tu, T. Shoji, M. Fujiyoshi, and K. Sato, J. Mater. Res. 19, 2887 (2004).

    Article  CAS  Google Scholar 

  9. M. Date, K.N. Tu, T. Shoji, M. Fujiyoshi, and K. Sato, Scripta Mater., 51, 641 (2004).

    Article  CAS  Google Scholar 

  10. K.L. Lin and H.M. Hsu, J. Electron. Mater. 30, 1068 (2001).

    Article  CAS  Google Scholar 

  11. S.P. Yu, M.C. Wang, and M.H. Hon, J. Mater. Res. 16, 76 (2004).

    Article  Google Scholar 

  12. S.C. Cheng and K.L. Lin, J. Electron. Mater. 31, 940 (2002).

    Article  CAS  Google Scholar 

  13. C.M. Chuang, H.T. Hung, P.C. Liu, and K.L. Lin, J. Electron. Mater. 33, 7 (2003).

    Article  Google Scholar 

  14. C.W. Huang and K.L. Lin, J. Mater. Res. 19, 3560 (2004).

    Article  CAS  Google Scholar 

  15. C.W. Huang and K.L. Lin, Mater. Trans. 45, 588 (2004).

    Article  CAS  Google Scholar 

  16. T.B. Massalski, H. Okamoto, P.R. Subramanian, and L. Kacprzak, eds., Binary Alloy Phase Diagrams (Materials Park, OH: ASM International, 1990), pp. 456–458.

    Google Scholar 

  17. T.B. Massalski, H. Okamoto, P.R. Subramanian, and L. Kacprzak, eds., Binary Alloy Phase Diagrams (Materials Park, OH: ASM International, 1990), pp. 2887–2889.

    Google Scholar 

  18. Y.C. Chan, M.Y. Chiu, and T.H. Chuang, Z. Metallkd. 93, 95 (2002).

    CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Institute of Materials Science and Engineering, Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan 804, Republic of China

    Shih-Chang Chang, Sheng-Chih Lin & Ker-Chang Hsieh

Authors
  1. Shih-Chang Chang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Sheng-Chih Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Ker-Chang Hsieh
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Chang, SC., Lin, SC. & Hsieh, KC. The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad. J. Electron. Mater. 35, 399–405 (2006). https://doi.org/10.1007/BF02690525

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02690525

Key words

Search

Navigation