Skip to main content
SpringerLink
Log in

Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In this article, we report the effect of cerium (Ce) addition on wettability, microstructure, and mechanical properties of Sn-3.9Ag-0.7Cu (SAC) solders. It was found that the wettability of Ce-containing solder on Cu substrate is comparable to that of SAC solder for compositions up to 0.5 wt% Ce. The microstructure of lap-shear joints containing 0.5 wt% Ce rare-earth elements showed a finer microstructure and a thinner Cu6Sn5 intermetallic layer at the Cu/solder interface. Using differential scanning calorimetry (DSC), it was found that the magnitude of undercooling was significantly reduced with the addition of Ce. It has been reported that SAC–0.5Ce alloy exhibited a much higher elongations compared with SAC alloy, however, the mechanism for the enhanced ductility is still not clear. Especially, the effect of Cu6Sn5 intermetallic layer thickness on ductility need to be further investigated. The results in this study showed that the presence of CeSn3 intermetallic particles, and not the thin Cu6Sn5 intermetallic layer, was responsible for the improved ductility demonstrated by Ce-containing solders. This finding revealed a new approach of enhancing the ductility, as well as the shock performance of Pb-free solder with additional alloying elements for the future solder alloy design.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12

Similar content being viewed by others

References

  1. E.P. Wood, K.L. Nimmo, J. Electron. Mater. 23(8), 709 (1994)

    Article  CAS  Google Scholar 

  2. M. Abtew, G. Selvaduray, Mater. Sci. Eng. 20(5–6), 95 (2000)

    Google Scholar 

  3. N.-C. Lee, Soldering Surf. Mount Technol. 9(2), 65–69 (1997)

    Article  CAS  Google Scholar 

  4. H. Ma, J.C. Suhling, J. Mater. Sci. 44(5), 1141 (2009)

    Article  CAS  Google Scholar 

  5. N. Chawla, Int. Mater. Rev. 54, 368–384 (2009)

    Article  CAS  Google Scholar 

  6. N.-C. Lee: International microsystems, packaging, assembly and circuits technology (IMPACT) conference, Oct, 44 (2007)

  7. I.E. Anderson, J. Mater. Sci.: Mater. Electron. 18, 55–76 (2007)

    Article  CAS  Google Scholar 

  8. M. Dittes, H. Walter, Soldering Surf. Mount. Technol. 15(1), 77 (2003)

    Article  Google Scholar 

  9. C.M.L. Wu, Y.W. Wong, J. Mater. Sci.: Mater. Electron. 18(1), 77 (2007)

    CAS  Google Scholar 

  10. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, J. Electron. Mater. 31, 921 (2002)

    Article  CAS  Google Scholar 

  11. A. Ramirez, H. Mavoori, S. Jin, Appl. Phys. Lett. 80(3), 398 (2002)

    Article  CAS  Google Scholar 

  12. Y. Shi, J. Tian, H. Hao, Z. Xia, Y. Lei, F. Guo, J. Alloys Compd. 453(1–2), 180 (2008)

    Article  CAS  Google Scholar 

  13. L. Zhang, S.-B. Xue, L–.L. Gao, Y. Chen, S.-L. Yu, Z. Sheng, G. Zeng, J. Mater. Sci.: Mater. Electron. 20, 1193 (2009)

    Article  CAS  Google Scholar 

  14. L.-L. Gao, S.-B. Xue, L. Zhang, Z.-X. Xiao, W. Dai, F. Ji, H. Ye, G. Zeng, J. Mater. Sci.: Mater. Electron. 21(9), 910 (2010)

    Article  CAS  Google Scholar 

  15. L.-L. Gao, S.-B. Xue, L. Zhang, Z. Sheng, G. Zeng, F. Ji, J. Mater. Sci.: Mater. Electron. 21(7), 643 (2010)

    Article  CAS  Google Scholar 

  16. Z. Chen, Y. Shi, Z. Xia, Y. Yan, J. Electron. Mater. 32(4), 235 (2003)

    Article  CAS  Google Scholar 

  17. X.-Y. Zhao, M.-Q. Zhao, X.-Q. Cui, T.-H. Xu, M.-X. Tong, Trans. Nonferrous Met. Soc. China 17(4), 805 (2007)

    Article  CAS  Google Scholar 

  18. D.Q. Yu, J. Zhao, L. Wang, J. Alloys Compd. 376(1–2), 170 (2004)

    Article  CAS  Google Scholar 

  19. M.A. Dudek, R.S. Sidhu, N. Chawla, M. Renavikar, J. Electron. Mater. 35(12), 2088 (2006)

    Article  CAS  Google Scholar 

  20. M.A. Dudek, N. Chawla, Metall. Mater. Trans. A 41(3), 610 (2010)

    Article  Google Scholar 

  21. M.A. Dudek, R.S. Sidhu, N. Chawla, JOM 58(6), 57 (2006)

    Article  CAS  Google Scholar 

  22. H.X. Xie, N. Chawla, K. Mirpuri, J. Electron. Mater. 41, 3249 (2012)

    Article  CAS  Google Scholar 

  23. M.A. Dudek, N. Chawla, Acta Mater. 57, 4588 (2009)

    Article  CAS  Google Scholar 

  24. M.A. Dudek, N. Chawla, J. Electron. Mater. 38(2), 210 (2009)

    Article  CAS  Google Scholar 

  25. X. Deng, R.S. Sidhu, P. Johnson, N. Chawla, Metall. Mater. Trans. A 36A, 55 (2005)

    Article  CAS  Google Scholar 

  26. N. Chawla, Y.-L. Shen, X. Deng, E.S. Ege, J. Electron. Mater. 33, 1589 (2004)

    Article  CAS  Google Scholar 

  27. H.X. Xie, N. Chawla, Y.-L. Shen, Microelectron. Reliab. 51, 1142 (2011)

    Article  CAS  Google Scholar 

  28. F. Ochoa, X. Deng, N. Chawla, J. Electron. Mater. 33(12), 1596 (2004)

    Article  CAS  Google Scholar 

  29. N. Chawla, F. Ochoa, V.V. Ganesh, X. Deng, M. Koopman, K.K. Chawla, S. Scarriitt, J. Mater. Sci.: Mater. Electron. 15, 385 (2004)

    Article  CAS  Google Scholar 

  30. X. Deng, G. Piotrowski, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1403 (2003)

    Article  CAS  Google Scholar 

  31. K.J. Puttlitz, K.A.Stalter, Handbook of lead-free solder technology for microelectronic assemblies. CRC Press 349 (2004)

  32. L. Wang, D.Q. Yu, J. Zhao, M.L. Huang, Mater. Lett. 56(6), 1039 (2002)

    Article  CAS  Google Scholar 

  33. H. Hao, J. Tian, Y.W. Shi, Y.P. Lei, Z.D. Xia, JEM 36(7), 766 (2007)

    Article  CAS  Google Scholar 

  34. I.E. Anderson, J. Mater. Sci.: Mater. Electron. 18, 55 (2007)

    Article  CAS  Google Scholar 

  35. L-W. Lin, J-M. Song, Y-S. Lai, Y.-T. Chiu, N.-C. Lee and J-Y. Uan, 49: 235 (2009)

  36. M.G. Cho, S.K. Kang, S.-K. Seo, D.-Y. Shih, H.M. Lee, J. Mater. Res. 24(2), 534 (2009)

    Article  CAS  Google Scholar 

  37. S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.-I. Cho, J. Yu, W.K. Choi, JOM 56(6), 34 (2004)

    Article  CAS  Google Scholar 

  38. Desk Handbook, in Phase Diagrams for Binary Alloys ed. by H. Okamoto, (ASM, Materials Park, OH, 2000)

  39. M.A. Dudek, N. Chawla, Mater. Charact. 59, 1364 (2006)

    Article  Google Scholar 

  40. K.S. Kim, S.H. Huh, K. Suganuma, J. Alloys Compd. 352(1–2), 226 (2003)

    Article  CAS  Google Scholar 

  41. D.Q. Yu, L. Wang, J. Alloys Compd. 458(1–2), 542 (2008)

    Article  CAS  Google Scholar 

  42. P.G. Harris, K.S. Chaggar, Solder Surf. Mount Technol. 10, 38 (1998)

    Article  CAS  Google Scholar 

  43. I.E. Anderson, J. Walleser, J.L. Harringa, JOM 59, 38 (2007)

    Article  CAS  Google Scholar 

  44. M. Amagai, Microelectron. Reliab. 42, 607 (2002)

    Article  Google Scholar 

  45. S. Fubin and S.W.R. Lee, in Electronic components and technology conference 2006 proceedings, 1196 (2006)

  46. Z. Huang, P. Kumar, P. Dutta, J.H.L. Pang, R. Sidhu, M. Renavikar, JEM 41, 375 (2012)

    Article  CAS  Google Scholar 

  47. H.X. Xie and N. Chawla, Microelectronics Reliability, in press (2013)

  48. H.X. Xie, N. Chawla, JEM 42(3), 527 (2013)

    Article  CAS  Google Scholar 

  49. H.F. Zou, Z.F. Zhang, Microelectron. Eng. 87, 601 (2010)

    Article  CAS  Google Scholar 

  50. H.T. Lee, M.H. Chen, H.M. Jao, T.L. Liao, Mater. Eng. A 358, 134 (2003)

    Article  Google Scholar 

  51. K.E. Yazzie, H.E. Fei, H. Jiang, N. Chawla, Acta Mater. 60, 4336 (2012)

    Article  CAS  Google Scholar 

  52. I. Anderson, J. Harringa, J. Electron. Mater. 35(1), 94 (2006)

    Article  CAS  Google Scholar 

  53. M. Amagai, Y. Toyoda, T. Ohnishi and S. Akita, in Electronic Components and Technology conference, 2004 Proceeding, 54th, 2, 1304 (2004)

  54. X. Deng, R.S. Sindu, P. Johnson, N. Chawla, Metall. Mater. Trans. A 36(1), 55 (2005)

    Article  Google Scholar 

  55. D. Ma, W.D. Wang, S.K. Lahiri, J. Appl. Phys. 91, 3312 (2002)

    Article  CAS  Google Scholar 

  56. K.E. Yazzie, H.X. Xie, J. Williams, N. Chawla, Scripta Mater. 66, 586 (2012)

    Article  CAS  Google Scholar 

  57. N. Chawla, Y.-L. Shen, X. Deng, E.S. Ege, JEM 33(12), 1589 (2004)

    Article  CAS  Google Scholar 

  58. Y.-L. Shen, N. Chawla, E.S. Ege, X. Deng, Acta Mater. 53(9), 2633 (2005)

    Article  CAS  Google Scholar 

Download references

Acknowledgments

The authors gratefully acknowledge financial support for this research from the Semiconductor Research Corporation (SRC) (with Drs. M. Renavikar, A. Aleksov, K. Mirpuri, P. Brofman, K. Zeng, Z. Zhang, and M. Varughese as industrial liaisons). The authors also thank David Wright from the Center for Solid State Science, Arizona State University (Tempe, AZ) for his assistance with evacuating the quartz tubes. The authors also thank James Mertens and Sudhanshu Singh for helpful discussion.

Author information

Author notes

  1. L. Jiang

    Present address: Implant Direct Sybron International, 27030 Malibu Hills Rd, Calabasas Hills, CA, 91301, USA

Authors and Affiliations

  1. Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, Tempe, AZ, 85287-6106, USA

    H. X. Xie, L. Jiang & N. Chawla

Authors
  1. H. X. Xie
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. L. Jiang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. N. Chawla
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to N. Chawla.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Xie, H.X., Jiang, L. & Chawla, N. Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys. J Mater Sci: Mater Electron 24, 3456–3466 (2013). https://doi.org/10.1007/s10854-013-1270-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-013-1270-7

Keywords

Search

Navigation