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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

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Abstract

Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu (SAC) solders has been improved radically by Co or Fe modifications. Several other SAC+X candidates (X=Mn, Ni, Ge, Ti, Si, Cr, and Zn) now have been tested. Solder joint microstructures and shear strength results show that new SAC+X alloys also suppress void formation and coalescence at the Cu (substrate)/Cu3Sn interface (and embrittlement) after aging at 150°C for up to 1,000 h. Microprobe measurements of 1,000 h aged samples suggest that Cu substitution by X is usually accentuated in the intermetallic layers, consistent with X=Co and Fe results.

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  1. Ames Laboratory (USDOE), Iowa State University, 50011, Ames, IA

    I. E. Anderson & J. L. Harringa

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  1. I. E. Anderson
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  2. J. L. Harringa
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Anderson, I.E., Harringa, J.L. Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints. J. Electron. Mater. 35, 94–106 (2006). https://doi.org/10.1007/s11664-006-0190-1

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  • DOI: https://doi.org/10.1007/s11664-006-0190-1

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