1. Design, test, integration and packaging of MEMS/MOEMS, 2005

   • Bernard Courtois
   • Bernd Michel

   Editorial 18 March 2006 Pages: 891 - 891

2. MEMS-based formaldehyde gas sensor integrated with a micro-hotplate

   • Chia-Yen Lee
   • Ping-Ru Hsieh
   • Che-Ming Chiang

   Technical paper 29 March 2006 Pages: 893 - 898

   

3. Triplex-pumping CD-like microfluidic platform with parabolic microchannels

   • G. J. Wang
   • C. H. Chang
   • H. Yang

   Technical paper 29 March 2006 Pages: 899 - 905

   

4. New production method of convex microlens arrays for integrated fluorescence microfluidic detection systems

   • H. Yang
   • R. F. Shyu
   • J.-W. Huang

   Technical paper 28 February 2006 Pages: 907 - 912

   

5. Micromachined silicon via-holes and interdigital bandpass filters

   • Jian Zhu
   • Yuanwei Yu
   • Yong Zhang

   Technical paper 14 March 2006 Pages: 913 - 917

   

6. Fabrication of silicon-based two-dimensional photonic crystals

   • Jian Zhu
   • Yong Zhang
   • Shixing Jia

   Technical paper 28 February 2006 Pages: 919 - 922

   

7. Fabrication process of a micro-inductor utilising a magnetic thin film core

   • D. Flynn
   • Nirmal Singh Sudan
   • M. P. Y. Desmulliez

   Technical Paper 11 April 2006 Pages: 923 - 933

   

8. Defect-free wet etching through pyrex glass using Cr/Au mask

   • Francis E. H. Tay
   • Ciprian Iliescu
   • Jianmin Miao

   Technical paper 07 March 2006 Pages: 935 - 939

   

9. Micro powder injection molding: process characterization and modeling

   • Richard Heldele
   • Michael Schulz
   • Jürgen Haußelt

   Technical paper 07 March 2006 Pages: 941 - 946

   

10. Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

    • M. Worgull
    • J. -F. Hétu
    • M. Heckele

    Technical paper 31 March 2006 Pages: 947 - 952

    

11. Micro-electro-mechanical systems fast fabrication by selective thick polysilicon growth in epitaxial reactor

    • O. De Sagazan
    • M. Denoual
    • O. Bonnaud

    Technical Paper 19 May 2006 Pages: 953 - 958

    

12. Horizontal buried channels in monocrystalline silicon

    • O. De Sagazan
    • M. Denoual
    • O. Bonnaud

    Technical Paper 06 July 2006 Pages: 959 - 963

    

13. Two-dimensional monomode optical fibre array manufacture using microengineering techniques

    • D. Weiland
    • M. Luetzelschwab
    • M. P. Y. Desmulliez

    Technical paper 10 March 2006 Pages: 965 - 972

    

14. Fabrication of planar and three-dimensional microcoils on flexible substrates

    • M. Woytasik
    • J.-P. Grandchamp
    • V. Mathet

    Technical paper 31 March 2006 Pages: 973 - 978

    

15. Elastic–plastic modeling of heat-treated bimorph micro-cantilevers

    • Chia-Yen Lee
    • Chien-Hsiung Tsai
    • Yung-Chuan Chen

    Technical Paper 30 March 2006 Pages: 979 - 986

    

16. A dielectrophoretic chip packaged at wafer level

    • Ciprian Iliescu
    • Francis E. H. Tay
    • Victor Samper

    Technical paper 16 March 2006 Pages: 987 - 992

    

17. MEMS-based combustor with hairpin-shape design of gas recirculation channel

    • Z. F. Wang
    • M. Wu
    • J. S. Hua

    Technical paper 16 March 2006 Pages: 993 - 997

    

18. The study of a novel crystal SiGeC far infrared sensor with thermal isolated by MEMS technology

    • M. C. Hsieh
    • Y. K. Fang
    • D. K. Jair

    Technical Paper 12 May 2006 Pages: 999 - 1004

    

19. Comparison of analysis methods for package-induced stresses on moulded Hall sensors

    • Sebastian Fischer
    • Harald Beyer
    • Jürgen Wilde

    Technical paper 29 March 2006 Pages: 1005 - 1009

    

20. Solder bonding with a buffer layer for MOEMS packaging using induction heating

    • Chao-Chang Hu
    • Shih-Yi Wen
    • Hsiao-Wen Lee

    Technical Paper 06 April 2006 Pages: 1011 - 1014

    

21. HF-contact elements for testing and multi chip module applications

    • G. Spanier
    • E. Slavcheva
    • W. Mokwa

    Technical paper 16 March 2006 Pages: 1015 - 1019

    

22. Gold metallizations for eutectic bonding of silicon wafers

    • S. Lani
    • A. Bosseboeuf
    • J. Aubert

    Technical paper 20 June 2006 Pages: 1021 - 1025

    

23. Micro ultrasonic welding: joining of chemically inert polymer microparts for single material fluidic components and systems

    • R. Truckenmüller
    • Y. Cheng
    • J. Lehmann

    Technical paper 07 April 2006 Pages: 1027 - 1029

    

24. Replication and bonding techniques for integrated microfluidic systems

    • M. Heckele
    • A. E. Guber
    • R. Truckenmüller

    Technical Paper 09 June 2006 Pages: 1031 - 1035

    

25. Development of a simple microsystems membrane probe card

    • M.D. Cooke
    • D. Wood

    Technical paper 03 March 2006 Pages: 1037 - 1044

    

26. Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system

    • Ming-Tzer Lin
    • Paul El-Deiry
    • Richard P. Vinci

    Technical paper 31 March 2006 Pages: 1045 - 1051

    

27. A capacitance and optical method for the static and dynamic characterization of micro electro mechanical systems (MEMS) devices

    • Eleonora Ferraris
    • Irene Fassi
    • Andrew Richardson

    Technical Paper 27 June 2006 Pages: 1053 - 1061

    

28. Vacuum measurement in wafer level encapsulations by interference microscopy

    • A. Bosseboeuf
    • J. P. Grandchamp
    • D. Bouville

    Technical Paper 02 August 2006 Pages: 1063 - 1069

    

29. Microelectromechanical systems vibration powered electromagnetic generator for wireless sensor applications

    • E. Koukharenko
    • S. P. Beeby
    • S. Roy

    Technical paper 25 April 2006 Pages: 1071 - 1077

    

30. Mems inertial power generators for biomedical applications

    • P. Miao
    • P. D. Mitcheson
    • B. H. Stark

    Technical Paper 04 April 2006 Pages: 1079 - 1083