Skip to main content
SpringerLink
Log in

HF-contact elements for testing and multi chip module applications

  • Technical paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

In this paper a platform based on the composite IC concept (Semiconductor Industry Association in The NTRS, pp 63, 1994) will be presented that is optimized for high frequency applications. Key elements of the platform are coplanar waveguides and micro springs that are processed using MEMS technologies. Rotation symmetric micro springs with diameters between 500 and 125 μm with different widths and thicknesses were designed, simulated and fabricated. The best mechanical properties were obtained from springs with a diameter of 250 μm. They were made by electroplating of a nickel–tungsten-alloy. FEM simulation of the high frequency performance shows a good performance up to frequencies of 10 GHz.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  • Fritz Th, Mokwa W, Schnakenberg U (2002) Galvanisch abgeschiedene NiW-Legierungsschichten für die Mikrosystemtechnik, Teil 2 Abscheidungen auf der Basis eines Sulfamatelektrolyten. Galvanotechnik 92(10):2684–2690

    Google Scholar 

  • Fritz T, Griepentrog M, Mokwa W, Schnakenberg U (2003) Determination of Young’s modulus of electroplated nickel. Electrochim Acta 48:3029–3035

    Article  Google Scholar 

  • Keil A, Merl W, Vinaricky E, Schröder KH, Weiser J (2002) Elektrische Kontakte, Werkstoffe und Anwendungen. Springer, Berlin Heidelberg New York, p 524

  • Krüger C (2003) PhD Thesis, Aachen University

  • Krüger C, Bartelink DJ, Fritz T, Leuerer T, Mokwa W, Schnakenberg U (2000) Micro springs for temporary chip connection. Sens Actuators A85:371–376

    Article  Google Scholar 

  • Krüger C, Lee IT, Mokwa W, Schnakenberg U (2004) NiW-micro springs for chip connection. In: Proceedings of the 17th IEEE international conference on micro electro mechanical systems, MEMS 2004, Maastricht, January 25–29, 2004, pp 117–120. ISBN 0-7803-8266-8

  • Semiconductor Industry Association (SIA) (1994) The national technology roadmap for semiconductors, San Jose, pp 63

Download references

Acknowledgements

This work was supported by the German Science Foundation, grant SFB 440.

Author information

Authors and Affiliations

  1. Institute of Materials in Electrical Engineering I, RWTH Aachen University, Sommerfeldstraße 24, 52074, Aachen, Germany

    G. Spanier, E. Slavcheva & W. Mokwa

Authors
  1. G. Spanier
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. E. Slavcheva
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. W. Mokwa
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to G. Spanier.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Spanier, G., Slavcheva, E. & Mokwa, W. HF-contact elements for testing and multi chip module applications. Microsyst Technol 12, 1015–1019 (2006). https://doi.org/10.1007/s00542-006-0133-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-006-0133-z

Keywords

Search

Navigation