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Micromachined silicon via-holes and interdigital bandpass filters

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Abstract

Several through-silicon-substrate-via-holes used in microwave circuits are analyzed. The silicon via-holes have been fabricated by inductively coupled plasma (ICP) process. Using via-holes for microstrip transmission lines, a micromachined Ku-band interdigital filter has been designed, fabricated, and tested. It achieved an insertion loss of −2.4 dB, and a 3 dB fractional bandwidth of 8%. This filter has the advantages of small sizes and relatively outstanding RF performance.

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Authors and Affiliations

  1. Department of Instrument Science and Engineering, Southeast University, 210096, Nanjing, China

    Jian Zhu & Bailing Zhou

  2. Nanjing Electronic Devices Institute, 210016, Nanjing, China

    Jian Zhu, Yuanwei Yu, Naibin Yang & Yong Zhang

Authors
  1. Jian Zhu
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  2. Yuanwei Yu
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  3. Naibin Yang
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  4. Bailing Zhou
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  5. Yong Zhang
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Corresponding author

Correspondence to Jian Zhu.

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Zhu, J., Yu, Y., Yang, N. et al. Micromachined silicon via-holes and interdigital bandpass filters. Microsyst Technol 12, 913–917 (2006). https://doi.org/10.1007/s00542-006-0122-2

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  • DOI: https://doi.org/10.1007/s00542-006-0122-2

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