1. Microsystem technologies: Foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2003

   • Bernard Courtois
   • Bernd Michel

   Foreword Pages: 345 - 345

2. Microsystem Technologies: Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2003

   • Bernard Courtois
   • Bernd Michel

   OriginalPaper Pages: 345 - 345

3. “Plug-up”—a new concept for fabricating SOI MEMS devices

   • J. Kiihamäki
   • J. Dekker
   • T. Mattila

   Technical Papers Pages: 346 - 350

4. “Plug-up”–a new concept for fabricating SOI MEMS devices

   • J. Kiihamäki
   • J. Dekker
   • T. Mattila

   OriginalPaper Pages: 346 - 350

5. New electroforming technology pressure aid for LIGA process

   • T. -H. Tsai
   • H. Yang
   • R. Chein

   Technical Papers Pages: 351 - 356

6. New electroforming technology pressure aid for LIGA process

   • T.-H. Tsai
   • H. Yang
   • R. Chein

   OriginalPaper Pages: 351 - 356

7. SU8 resist plasma etching and its optimisation

   • G. Hong
   • A. S. Holmes
   • M. E. Heaton

   Technical Papers Pages: 357 - 359

8. SU8 resist plasma etching and its optimisation

   • G. Hong
   • A.S. Holmes
   • M.E. Heaton

   OriginalPaper Pages: 357 - 359

9. Thin film formation on non-planar surface with use of spray coating fabrication

   • M. Ichiki
   • L. Zhang
   • R. Maeda

   Technical Papers Pages: 360 - 363

10. Thin film formation on non-planar surface with use of spray coating fabrication

    • M. Ichiki
    • L. Zhang
    • R. Maeda

    OriginalPaper Pages: 360 - 363

11. Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

    • C. Rusu
    • H. Jansen
    • A. Witvrouw

    Technical Papers Pages: 364 - 371

12. Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

    • A. Witvrouw
    • C. Rusu
    • R. Gunn

    OriginalPaper Pages: 364 - 371

13. Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures

    • R. Truckenmüller
    • P. Henzi
    • W. K. Schomburg

    Technical Papers Pages: 372 - 374

14. Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures

    • R. Truckenmüller
    • P. Henzi
    • W.K. Schomburg

    OriginalPaper Pages: 372 - 374

15. Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

    • B. Wunderle
    • J. Auersperg
    • B. Michel

    Technical Papers Pages: 375 - 381

16. Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

    • B. Wunderle
    • J. Auersperg
    • B. Michel

    OriginalPaper Pages: 375 - 381

17. Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell

    • L. Fonseca
    • E. Cabruja
    • S. Marco

    Technical Papers Pages: 382 - 386

18. Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell

    • L. Fonseca
    • E. Cabruja
    • S. Marco

    OriginalPaper Pages: 382 - 386

19. Dynamic modeling of interactions between fields and matter in MEMS devices

    • K. Zeng
    • Z. Liu
    • J. G. Korvink

    Technical Papers Pages: 387 - 392

20. Dynamic modeling of interactions between fields and matter in MEMS devices

    • K. Zeng
    • Z. Liu
    • J.G. Korvink

    OriginalPaper Pages: 387 - 392

21. Parallel-beams/lever electrothermal out-of-plane actuator

    • S. Deladi
    • G. Krijnen
    • M. C. Elwenspoek

    Technical Papers Pages: 393 - 399

22. Parallel-beams/lever electrothermal out-of-plane actuator

    • S. Deladi
    • G. Krijnen
    • M.C. Elwenspoek

    OriginalPaper Pages: 393 - 399

23. Design and simulation of MEMS optical switch using photonic bandgap crystal

    • H. G. Teo
    • A. Q. Liu
    • T. Bourouina

    Technical Papers Pages: 400 - 406

24. Design and simulation of MEMS optical switch using photonic bandgap crystal

    • H.G. Teo
    • A.Q. Liu
    • T. Bourouina

    OriginalPaper Pages: 400 - 406

25. Yield strength of thin-film parylene-C

    • C. Y. Shih
    • T. A. Harder
    • Y. C. Tai

    Technical Papers Pages: 407 - 411

26. Yield strength of thin-film parylene-C

    • C.Y. Shih
    • T.A. Harder
    • Y.C. Tai

    OriginalPaper Pages: 407 - 411

27. Fracture behaviour of single crystal silicon microstructures

    • F. Favalli Meroni
    • E. Mazza

    Technical Papers Pages: 412 - 418

28. Fracture behaviour of single crystal silicon microstructures

    • F. Favalli Meroni
    • E. Mazza

    OriginalPaper Pages: 412 - 418

29. Ensuring repeatability in LIGA mold insert fabrication

    • J. Schulz
    • K. Bade
    • F. Winkler

    Technical Papers Pages: 419 - 422

30. Ensuring repeatability in LIGA mold insert fabrication

    • J. Schulz
    • K. Bade
    • F. Winkler

    OriginalPaper Pages: 419 - 422

31. Development of a novel self-sensitive atomic force microscope for nondestructive measurement of micro vertical surfaces

    • T. Kobayashi
    • Y. Murakoshi
    • R. Maeda

    Technical Papers Pages: 423 - 425

32. Development of a novel self-sensitive atomic force microscope for nondestructive measurement of micro vertical surfaces

    • T. Kobayashi
    • Y. Murakoshi
    • R. Maeda

    OriginalPaper Pages: 423 - 425

33. Design, fabrication, and test of a peristaltic micropump

    • M. Knight
    • J. House

    Technical Papers Pages: 426 - 431

34. Design, fabrication, and test of a peristaltic micropump

    • M. Knight
    • J. House

    OriginalPaper Pages: 426 - 431

35. New aspects of simulation in hot embossing

    • M. Worgull
    • M. Heckele

    Technical Papers Pages: 432 - 437

36. New aspects of simulation in hot embossing

    • M. Worgull
    • M. Heckele

    OriginalPaper Pages: 432 - 437