Abstract
A new microelectroforming technique using air-pressure assistance in the electrolyte is introduced. The related theories and experiments are reported in this paper. The pressurized electrolyte reduces hydrogen bubble formation and defect on the substrate surface. The high pressure electrolyte limits bubble formation in electroforming. It also produces good throwing power from the experimental sample observations. The edges of the electroformed workpiece using the pressurized method were smoother than those produced using conventional electroforming. The metallurgical grains were finer when higher pressures were applied in the electrolyte based on SEM micrographs. Pressurized electroforming can increase the allowable current density, which can shorten plating time in the LIGA process. The high growth rate due to large applied current density results in large electroforming microstructure grains. The surface morphology of pressurized electroformed samples were improved compared with the conventional method.
Similar content being viewed by others
References
Yang H;Pan C-T;Chou M-C (2001) Ultra-fine machining tool/molds by LIGA technology. J Micromech Microeng 11(2): 94–99
Bacher W;Menz W;Mohr J (1995) The LIGA Technique and its potential for Microsystems. IEEE Trans Ind Electr 42(5): 431–441
Kondo R;Takimoto S;Suzuki K;Suguyama S (2000) High aspect ratio electrostatic micro actuators using LIGA process. Microsystem Technologies 6: 218–221
Yen et al. (2000) Proc. of Chinese Material Science Annual Symposium (in Chinese)
Dickerson RE; Gray HB; Haight GP (1973) Chemical Principles.
Wei Z-J;Wang Y-Y;Wan C-C;Huang C-H (2000) Study of wetters in nickel electroforming of 3-D microstructures. Materials Chemistry and Physics 63: 235–239
Lowenheim FA (1963) Modern Electroplating, 2nd ed. John Wiley & Sons, Inc., New York
Rice OK (1947) The effect of pressure on surface tension. J Chem Phys 15(5): 333–335
Silberberg M (1996) Chemistry, Mosby-Year Book, Inc
Slowinski E;Gates EE;Waring CE (1957) The effect of pressure on the surface tensions of liquids. J Phys Chem 61: 808–813
Author information
Authors and Affiliations
Corresponding author
Additional information
This work was supported by the National Science Council (series no. NSC91-2623-7-005-002) of Taiwan.
Rights and permissions
About this article
Cite this article
Tsai, T.H., Yang, H. & Chein, R. New electroforming technology pressure aid for LIGA process. Microsystem Technologies 10, 351–356 (2004). https://doi.org/10.1007/BF02637102
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF02637102