1. Fumed-Alumina-Derived Nanoporous Alumina as a New Low-k Dielectric Material for Microelectronics Packaging

   • Yoshihiro Takizawa
   • D. D. L. Chung

   OriginalPaper 26 February 2015 Pages: 2211 - 2220

2. Effects of Gd-Substitutions on the Microstructure, Electrical and Electromagnetic Behavior of M-Type Hexagonal Ferrites

   • Ishtiaq Ahmad
   • Mahmood Ahmad
   • Mukhtar Ahmad

   OriginalPaper 06 March 2015 Pages: 2221 - 2229

3. On the Manipulation of Ferroelectric and Ferroelastic Domains at the Nanoscale

   • Colm Durkan
   • Jose Angel Garcia-Melendrez
   • Long Ding

   OriginalPaper 26 February 2015 Pages: 2230 - 2242

4. Microwave-Assisted Synthesis of High Dielectric Constant CaCu₃Ti₄O₁₂ from Sol–Gel Precursor

   • Xin Ouyang
   • Peng Cao
   • Wei Gao

   OriginalPaper 06 March 2015 Pages: 2243 - 2249

5. Hysteresis Phenomenon in Heat–Voltage Curves of Polypyrrole-Coated Electrospun Nanofibrous and Regular Fibrous Mats

   • Azam Oroumei
   • Hossein Tavanai
   • Mohammad Morshed

   OriginalPaper 24 February 2015 Pages: 2250 - 2259

6. AC Hopping Conductance in Nanocomposite Films with Ferromagnetic Alloy Nanoparticles in a PbZrTiO₃ Matrix

   • T.N. Koltunowicz
   • P. Zukowski
   • J. Kasiuk

   OriginalPaper Open access 13 March 2015 Pages: 2260 - 2268

7. Superior Dielectric Performance of Engineering Thermoplastic as a Result of In situ Embedding of Nanoscale Mixed-Phase Molybdenum Oxide

   • Nilam Qureshi
   • Manish Shinde
   • Dinesh P. Amalnerkar

   OriginalPaper 27 February 2015 Pages: 2269 - 2275

8. Synthesis and Properties of Single Domain Strontium Hexa-ferrite Ultrafine Powders via a Surfactant-Assisted Co-precipitation Method

   • Junliang Liu
   • Xiulei Chen
   • Ming Zhang

   OriginalPaper 10 March 2015 Pages: 2276 - 2282

9. Increase of Piezoelectric Constant and Thermal Durability of Polypropylene Electret by Introducing SiO₂ and Kaolin Filler and Creating a Cellular Structure

   • E. Klimiec
   • B. Królikowski
   • J. Dzwonkowski

   OriginalPaper 24 March 2015 Pages: 2283 - 2291

10. Size-Controllable Synthesis of Fe₃O₄ Nanospheres for Electromagnetic Wave Absorber

    • Yanping Wang
    • Danping Sun
    • Wei Jiang

    OriginalPaper 24 March 2015 Pages: 2292 - 2299

11. Measurement of Dielectric Properties of Ultrafine BaTiO₃ Using an Organic–Inorganic Composite Method

    • Jie Bao
    • Weiwang Wang
    • Johan Liu

    OriginalPaper 27 March 2015 Pages: 2300 - 2307

12. Tuning Magnetic Behavior of Nanoscale Cobalt Sulfide and Its Nanocomposite with an Engineering Thermoplastic

    • Narendra Rumale
    • Sudhir Arbuj
    • Dinesh Amalnerkar

    OriginalPaper 30 April 2015 Pages: 2308 - 2311

13. Low-Temperature Sintering and Microwave Dielectric Properties of Zn₂SiO₄ Ceramic Added with Crystalline Zinc Borate

    • Varsha Chaware
    • Ravindra Deshmukh
    • Girish Phatak

    OriginalPaper 14 April 2015 Pages: 2312 - 2320

14. Ferroelectric and Magnetodielectric Properties of Cobalt-Doped Sr _x Ba_1−x Nb₂O₆ Ceramics

    • S. H. Kshirsagar
    • A. N. Tarale
    • P. B. Joshi

    OriginalPaper 28 April 2015 Pages: 2321 - 2330

15. Investigation of the Absorption Properties of the Alloys Fe-Ni and Fe-Ni-Cr Prepared by Mechanical Alloying

    • Gu Shuchao
    • Duan Yuping
    • Liu Yuzhe

    OriginalPaper 01 May 2015 Pages: 2331 - 2339

16. Effects of Bi₂O₃, TiO₂, and Bi₄Ti₃O₁₂ Seeding Layers on the Structural and Electrical Properties of Bi_3.25La_0.75Ti₃O₁₂ Thin Films Grown by a Sol–Gel Method

    • Ling Pei
    • Ni Hu
    • Meiya Li

    OriginalPaper 14 May 2015 Pages: 2340 - 2347

17. Orientation-Dependent Properties of CoFe₂O₄-Bi_3.15Nd_0.85Ti₃O₁₂ Bilayer Multiferroic Films Prepared by a Sol–Gel Method

    • Fuwei Zhang
    • Feng Yang
    • Minghua Tang

    OriginalPaper 06 March 2015 Pages: 2348 - 2352

18. Enhanced Dielectric Properties and High-Temperature Microwave Absorption Performance of Zn-Doped Al₂O₃ Ceramic

    • Yuan Wang
    • Fa Luo
    • Dongmei Zhu

    OriginalPaper 22 April 2015 Pages: 2353 - 2358

19. Dielectric and Electrical Properties of BiFeO₃–LiTaO₃ Systems

    • Suchismita Mohanty
    • R.N.P. Choudhary

    OriginalPaper 05 May 2015 Pages: 2359 - 2368

20. Dielectric Behavior and Magnetic Properties of Mn-Substituted Ni–Zn Ferrites

    • Muhammad Irfan
    • N. A. Niaz
    • N. R. Khalid

    OriginalPaper 22 April 2015 Pages: 2369 - 2377

21. High Dielectric Constants of Composites of Fiber-Like Copper Phthalocyanine-Coated Graphene Oxide Embedded in Poly(arylene Ether Nitriles)

    • Jingwei Li
    • Zejun Pu
    • Xiaobo Liu

    OriginalPaper 06 March 2015 Pages: 2378 - 2386

22. Al-Ge Diffusion Bonding for Hermetic Sealing Application

    • Vivek Chidambaram
    • Sunil Wickramanayaka

    OriginalPaper 06 March 2015 Pages: 2387 - 2395

23. Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer

    • H. Y. Zhang
    • X. W. Zhang

    OriginalPaper 13 March 2015 Pages: 2396 - 2405

24. Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process

    • Seung-Woo Lee
    • Tae-Hyung Lee
    • Hyun-Joong Kim

    OriginalPaper 26 March 2015 Pages: 2406 - 2413

25. Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions

    • Van Luong Nguyen
    • Ho-Kyung Kim

    OriginalPaper 01 April 2015 Pages: 2414 - 2421

26. Phase Equilibria of the Sn–Ni–Si Ternary System and Interfacial Reactions in Sn–(Cu)/Ni–Si Couples

    • Gu Fang
    • Chih-chi Chen

    OriginalPaper 08 April 2015 Pages: 2422 - 2431

27. Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil

    • Sang Xiong
    • Jianlin Sun
    • Xundong Yan

    OriginalPaper 21 April 2015 Pages: 2432 - 2439

28. Creep Behavior of 95.8Sn–3.5Ag–0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints

    • Y. Tang
    • G. Y. Li
    • B. Zhou

    OriginalPaper 21 April 2015 Pages: 2440 - 2449

29. Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

    • Yang Liu
    • Fenglian Sun
    • Guoqi Zhang

    OriginalPaper 18 April 2015 Pages: 2450 - 2457

30. Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

    • Yong-Ho Ko
    • Min-Su Kim
    • Chang-Woo Lee

    OriginalPaper 17 April 2015 Pages: 2458 - 2466

31. CH₄/Ar/H₂/SF₆ Plasma Etching for Surface Oxide Removal of Indium Bumps

    • Yue Huang
    • Chun Lin
    • Rui-Jun Ding

    OriginalPaper 22 April 2015 Pages: 2467 - 2472

32. Influence of BaTiO₃ Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

    • Li Yang
    • Jun Dai
    • Haixiang Liu

    OriginalPaper 12 May 2015 Pages: 2473 - 2478

33. Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

    • Wenjun Chen
    • Dunying Deng
    • Fei Xiao

    OriginalPaper 05 May 2015 Pages: 2479 - 2487

34. Preventing Electrical Shorts in Parallel-Plate Capacitors with Single-Printed Dielectric Layer

    • Maša Horvat
    • Tjaša Vidmar
    • Marta Klanjšek Gunde

    OriginalPaper 12 May 2015 Pages: 2488 - 2496

35. Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique

    • Pei-Chi Chen
    • Yen-Fu Su
    • Kuo-Ning Chiang

    OriginalPaper 12 May 2015 Pages: 2497 - 2506

36. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging

    • Roslina Ismail
    • Ghazali Omar
    • Burhanuddin Yeop Majlis

    OriginalPaper 14 May 2015 Pages: 2507 - 2513

37. Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition

    • S.M. Mehdi
    • K.H. Cho
    • K.H. Choi

    OriginalPaper 14 May 2015 Pages: 2514 - 2521

38. Polystyrene-Core Silica-Shell Composite Abrasives: The Influence of Core Size on Oxide Chemical Mechanical Planarization

    • Ailian Chen
    • Yang Chen
    • Jianning Ding

    OriginalPaper 14 May 2015 Pages: 2522 - 2528

39. Enhancing Chemical Stability of Electroplated Cu Films by Engineering Electrolyte Chemistry and Twinning Structure

    • Chih-Jie Yang
    • Chun-Lung Huang
    • Chien-Neng Liao

    OriginalPaper 19 May 2015 Pages: 2529 - 2535

40. Study of Optical and Electrical Properties of In₂S₃:Sn Films Deposited by Spray Pyrolysis

    • M. Kraini
    • N. Bouguila
    • S. Alaya

    OriginalPaper 09 May 2015 Pages: 2536 - 2543

41. Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment

    • M.A. Matin
    • K. Oishi
    • M. Ishida

    OriginalPaper 24 February 2015 Pages: 2544 - 2553

42. Erratum to: Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment

    • M.A. Matin
    • K. Oishi
    • M. Ishida

    Erratum 18 March 2015 Pages: 2554 - 2554