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Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process

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Abstract

Ultraviolet (UV)-curable urethane acrylic oligomers were synthesized and then modified by the incorporation of silicone diols with different molecular weights to improve thermal stability for temporary bonding and debonding adhesives in a three-dimensional multi-chip package process. The UV-curing behaviors were investigated using photo-differential scanning calorimetry, Fourier transform infrared spectroscopy-attenuated total reflectance, and gel fraction, while the UV-curing kinetics was also studied. In addition, the thermal stability of the samples was checked using thermogravimetric analysis. UV-curing and thermal stability were more affected by the molecular weight of the silicone diols than by UV dose due to both the flexibility and the steric hindrance of the synthesized oligomer structures.

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Authors and Affiliations

  1. Laboratory of Adhesion & Bio-Composites, Program in Environmental Materials Science, Research Institute for Agriculture & Life Sciences, Seoul National University, Seoul, 151-921, Republic of Korea

    Seung-Woo Lee, Tae-Hyung Lee, Ji-Won Park & Hyun-Joong Kim

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  1. Seung-Woo Lee
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  2. Tae-Hyung Lee
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  3. Ji-Won Park
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  4. Hyun-Joong Kim
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Correspondence to Hyun-Joong Kim.

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Lee, SW., Lee, TH., Park, JW. et al. Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process. J. Electron. Mater. 44, 2406–2413 (2015). https://doi.org/10.1007/s11664-015-3718-4

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  • DOI: https://doi.org/10.1007/s11664-015-3718-4

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