Fumed-Alumina-Derived Nanoporous Alumina as a New Low-k Dielectric Material for Microelectronics Packaging Yoshihiro TakizawaD. D. L. Chung OriginalPaper 26 February 2015 Pages: 2211 - 2220
Effects of Gd-Substitutions on the Microstructure, Electrical and Electromagnetic Behavior of M-Type Hexagonal Ferrites Ishtiaq AhmadMahmood AhmadMukhtar Ahmad OriginalPaper 06 March 2015 Pages: 2221 - 2229
On the Manipulation of Ferroelectric and Ferroelastic Domains at the Nanoscale Colm DurkanJose Angel Garcia-MelendrezLong Ding OriginalPaper 26 February 2015 Pages: 2230 - 2242
Microwave-Assisted Synthesis of High Dielectric Constant CaCu3Ti4O12 from Sol–Gel Precursor Xin OuyangPeng CaoWei Gao OriginalPaper 06 March 2015 Pages: 2243 - 2249
Hysteresis Phenomenon in Heat–Voltage Curves of Polypyrrole-Coated Electrospun Nanofibrous and Regular Fibrous Mats Azam OroumeiHossein TavanaiMohammad Morshed OriginalPaper 24 February 2015 Pages: 2250 - 2259
AC Hopping Conductance in Nanocomposite Films with Ferromagnetic Alloy Nanoparticles in a PbZrTiO3 Matrix T.N. KoltunowiczP. ZukowskiJ. Kasiuk OriginalPaper Open access 13 March 2015 Pages: 2260 - 2268
Superior Dielectric Performance of Engineering Thermoplastic as a Result of In situ Embedding of Nanoscale Mixed-Phase Molybdenum Oxide Nilam QureshiManish ShindeDinesh P. Amalnerkar OriginalPaper 27 February 2015 Pages: 2269 - 2275
Synthesis and Properties of Single Domain Strontium Hexa-ferrite Ultrafine Powders via a Surfactant-Assisted Co-precipitation Method Junliang LiuXiulei ChenMing Zhang OriginalPaper 10 March 2015 Pages: 2276 - 2282
Increase of Piezoelectric Constant and Thermal Durability of Polypropylene Electret by Introducing SiO2 and Kaolin Filler and Creating a Cellular Structure E. KlimiecB. KrólikowskiJ. Dzwonkowski OriginalPaper 24 March 2015 Pages: 2283 - 2291
Size-Controllable Synthesis of Fe3O4 Nanospheres for Electromagnetic Wave Absorber Yanping WangDanping SunWei Jiang OriginalPaper 24 March 2015 Pages: 2292 - 2299
Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic–Inorganic Composite Method Jie BaoWeiwang WangJohan Liu OriginalPaper 27 March 2015 Pages: 2300 - 2307
Tuning Magnetic Behavior of Nanoscale Cobalt Sulfide and Its Nanocomposite with an Engineering Thermoplastic Narendra RumaleSudhir ArbujDinesh Amalnerkar OriginalPaper 30 April 2015 Pages: 2308 - 2311
Low-Temperature Sintering and Microwave Dielectric Properties of Zn2SiO4 Ceramic Added with Crystalline Zinc Borate Varsha ChawareRavindra DeshmukhGirish Phatak OriginalPaper 14 April 2015 Pages: 2312 - 2320
Ferroelectric and Magnetodielectric Properties of Cobalt-Doped Sr x Ba1−x Nb2O6 Ceramics S. H. KshirsagarA. N. TaraleP. B. Joshi OriginalPaper 28 April 2015 Pages: 2321 - 2330
Investigation of the Absorption Properties of the Alloys Fe-Ni and Fe-Ni-Cr Prepared by Mechanical Alloying Gu ShuchaoDuan YupingLiu Yuzhe OriginalPaper 01 May 2015 Pages: 2331 - 2339
Effects of Bi2O3, TiO2, and Bi4Ti3O12 Seeding Layers on the Structural and Electrical Properties of Bi3.25La0.75Ti3O12 Thin Films Grown by a Sol–Gel Method Ling PeiNi HuMeiya Li OriginalPaper 14 May 2015 Pages: 2340 - 2347
Orientation-Dependent Properties of CoFe2O4-Bi3.15Nd0.85Ti3O12 Bilayer Multiferroic Films Prepared by a Sol–Gel Method Fuwei ZhangFeng YangMinghua Tang OriginalPaper 06 March 2015 Pages: 2348 - 2352
Enhanced Dielectric Properties and High-Temperature Microwave Absorption Performance of Zn-Doped Al2O3 Ceramic Yuan WangFa LuoDongmei Zhu OriginalPaper 22 April 2015 Pages: 2353 - 2358
Dielectric and Electrical Properties of BiFeO3–LiTaO3 Systems Suchismita MohantyR.N.P. Choudhary OriginalPaper 05 May 2015 Pages: 2359 - 2368
Dielectric Behavior and Magnetic Properties of Mn-Substituted Ni–Zn Ferrites Muhammad IrfanN. A. NiazN. R. Khalid OriginalPaper 22 April 2015 Pages: 2369 - 2377
High Dielectric Constants of Composites of Fiber-Like Copper Phthalocyanine-Coated Graphene Oxide Embedded in Poly(arylene Ether Nitriles) Jingwei LiZejun PuXiaobo Liu OriginalPaper 06 March 2015 Pages: 2378 - 2386
Al-Ge Diffusion Bonding for Hermetic Sealing Application Vivek ChidambaramSunil Wickramanayaka OriginalPaper 06 March 2015 Pages: 2387 - 2395
Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer H. Y. ZhangX. W. Zhang OriginalPaper 13 March 2015 Pages: 2396 - 2405
Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process Seung-Woo LeeTae-Hyung LeeHyun-Joong Kim OriginalPaper 26 March 2015 Pages: 2406 - 2413
Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions Van Luong NguyenHo-Kyung Kim OriginalPaper 01 April 2015 Pages: 2414 - 2421
Phase Equilibria of the Sn–Ni–Si Ternary System and Interfacial Reactions in Sn–(Cu)/Ni–Si Couples Gu FangChih-chi Chen OriginalPaper 08 April 2015 Pages: 2422 - 2431
Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil Sang XiongJianlin SunXundong Yan OriginalPaper 21 April 2015 Pages: 2432 - 2439
Creep Behavior of 95.8Sn–3.5Ag–0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints Y. TangG. Y. LiB. Zhou OriginalPaper 21 April 2015 Pages: 2440 - 2449
Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate Yang LiuFenglian SunGuoqi Zhang OriginalPaper 18 April 2015 Pages: 2450 - 2457
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Yong-Ho KoMin-Su KimChang-Woo Lee OriginalPaper 17 April 2015 Pages: 2458 - 2466
CH4/Ar/H2/SF6 Plasma Etching for Surface Oxide Removal of Indium Bumps Yue HuangChun LinRui-Jun Ding OriginalPaper 22 April 2015 Pages: 2467 - 2472
Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder Li YangJun DaiHaixiang Liu OriginalPaper 12 May 2015 Pages: 2473 - 2478
Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention Wenjun ChenDunying DengFei Xiao OriginalPaper 05 May 2015 Pages: 2479 - 2487
Preventing Electrical Shorts in Parallel-Plate Capacitors with Single-Printed Dielectric Layer Maša HorvatTjaša VidmarMarta Klanjšek Gunde OriginalPaper 12 May 2015 Pages: 2488 - 2496
Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique Pei-Chi ChenYen-Fu SuKuo-Ning Chiang OriginalPaper 12 May 2015 Pages: 2497 - 2506
The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging Roslina IsmailGhazali OmarBurhanuddin Yeop Majlis OriginalPaper 14 May 2015 Pages: 2507 - 2513
Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricated by Electrospray Deposition S.M. MehdiK.H. ChoK.H. Choi OriginalPaper 14 May 2015 Pages: 2514 - 2521
Polystyrene-Core Silica-Shell Composite Abrasives: The Influence of Core Size on Oxide Chemical Mechanical Planarization Ailian ChenYang ChenJianning Ding OriginalPaper 14 May 2015 Pages: 2522 - 2528
Enhancing Chemical Stability of Electroplated Cu Films by Engineering Electrolyte Chemistry and Twinning Structure Chih-Jie YangChun-Lung HuangChien-Neng Liao OriginalPaper 19 May 2015 Pages: 2529 - 2535
Study of Optical and Electrical Properties of In2S3:Sn Films Deposited by Spray Pyrolysis M. KrainiN. BouguilaS. Alaya OriginalPaper 09 May 2015 Pages: 2536 - 2543
Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment M.A. MatinK. OishiM. Ishida OriginalPaper 24 February 2015 Pages: 2544 - 2553
Erratum to: Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment M.A. MatinK. OishiM. Ishida Erratum 18 March 2015 Pages: 2554 - 2554