Volume 43, Issue 1

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January 2014

Special Sections from the 2013 TMS Annual Meeting: Lead-Free Solders; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reaction Phase Formation in Electronic Materials. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang

37 articles in this issue

Mitigation of Sn Whisker Growth by Small Bi Additions
Jung-Lae Jo
Shijo Nagao
Katsuaki Suganuma
OriginalPaper 04 September 2013 Pages: 1 - 8
Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum
Chin C. Lee
Shou-Jen Hsu
Yuan-Yun Wu
OriginalPaper 28 August 2013 Pages: 9 - 15
Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications
C. E. Ho
S. J. Wang
W. H. Wu
OriginalPaper 11 July 2013 Pages: 16 - 25
Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders
Sihan Liu
Limin Ma
Fu Guo
OriginalPaper 17 July 2013 Pages: 26 - 32
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy
H.X. Xie
D. Friedman
N. Chawla
OriginalPaper 11 July 2013 Pages: 33 - 42
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
Xioranny Linares
Chris Kinney
J. W. Morris Jr.
OriginalPaper 08 October 2013 Pages: 43 - 51
Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis
Hsueh-Hsien Hsu
Tz-Cheng Chiu
Albert T. Wu
OriginalPaper 31 October 2013 Pages: 52 - 56
Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications
Bite Zhou
Govindarajan Muralidharan
Thomas R. Bieler
OriginalPaper 10 October 2013 Pages: 57 - 68
Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
Tae-Kyu Lee
Choong-Un Kim
Thomas R. Bieler
OriginalPaper 04 September 2013 Pages: 69 - 79
In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers
Fei Pei
Eric Chason
OriginalPaper 19 November 2013 Pages: 80 - 87
Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints
Z. Huang
P. Kumar
R. Mahajan
OriginalPaper 20 September 2013 Pages: 88 - 95
Multiphase Resistivity Model for Magnetic Nanocomposites Developed for High Frequency, High Power Transformation
V. DeGeorge
S. Shen
M. E. McHenry
OriginalPaper 05 December 2013 Pages: 96 - 108
Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature
Jesus N. Calata
Guo-Quan Lu
Luu Nguyen
OriginalPaper 12 October 2013 Pages: 109 - 116
High-Frequency Inductor Materials
L. K. Varga
OriginalPaper 31 October 2013 Pages: 117 - 120
Texture and Magnetic Properties of Rolled Fe-6.5 wt.%Si Thin Sheets
Y. C. Yao
Y. H. Sha
L. Zuo
OriginalPaper 26 November 2013 Pages: 121 - 125
Soft Magnetic Alloy–Polymer Composite for High-Frequency Power Electronics Application
Jesus N. Calata
Guo-Quan Lu
Khai Ngo
OriginalPaper 19 November 2013 Pages: 126 - 131
Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism
Ling Wang
Chao Wan
Mingyu Li
OriginalPaper 08 October 2013 Pages: 132 - 136
Effect of Mo Addition on Structure and Magnetocaloric Effect in γ-FeNi Nanocrystals
Huseyin Ucar
Mark Craven
M. E. McHenry
OriginalPaper 29 August 2013 Pages: 137 - 141
Structure–Property Correlations in CoFe–SiO₂ Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques
P.R. Ohodnicki Jr.
V. Sokalski
D.E. Laughlin
OriginalPaper 29 August 2013 Pages: 142 - 150
Characterization of ALD Beryllium Oxide as a Potential High-k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs
Derek W. Johnson
Jung Hwan Yum
H. Rusty Harris
OriginalPaper 25 September 2013 Pages: 151 - 154
Interfacial Reactions of High-Bi Alloys on Various Substrates
Jin-Yi Wang
Chih-Ming Chen
Yee-Wen Yen
OriginalPaper 15 August 2013 Pages: 155 - 165
Nanomeshed Pt(Au) Transparent Contact to p-GaN of Light-Emitting Diode
Xu Feng Li
Cheng-Chieh Chang
Cheng-Yi Liu
OriginalPaper 06 November 2013 Pages: 166 - 169
Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints
Y. J. Hu
Y. C. Hsu
C. Y. Liu
OriginalPaper 30 October 2013 Pages: 170 - 175
Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys
Md. Arifur Rahman
Chia-Wei Fan
Wojciech Gierlotka
SI: Electronic Materials XII 04 October 2013 Pages: 176 - 186
Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates
Yee-Wen Yen
Yu-Ping Hsieh
Yi-Shan Li
OriginalPaper 18 September 2013 Pages: 187 - 194
Dissolution and Interfacial Reactions of (Cu,Ni)₆Sn₅ Intermetallic Compound in Molten Sn-Cu-Ni Solders
Chao-hong Wang
Wei-han Lai
Sinn-wen Chen
OriginalPaper 21 August 2013 Pages: 195 - 203
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
Shih-kang Lin
Cheng-liang Cho
Hao-miao Chang
OriginalPaper 04 September 2013 Pages: 204 - 211
Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization
Jau-Shiung Fang
Wu-Jia Su
Tsung-Shune Chin
OriginalPaper 18 September 2013 Pages: 212 - 218
EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
S. J. Wang
L. H. Hsu
C. E. Ho
OriginalPaper 18 September 2013 Pages: 219 - 228
Optical Properties of Al_xO_y/Ni/Al_xO_y Multilayered Absorber Coatings Prepared by Reactive DC Magnetron Sputtering
T. K. Tsai
S. J. Hsueh
J. S. Fang
OriginalPaper 29 October 2013 Pages: 229 - 235
Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging
Hao Hsu
Tzu-Yang Lin
Fan-Yi Ouyang
OriginalPaper 31 October 2013 Pages: 236 - 246
Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures
M. Hashiba
W. Shinmei
M. Kajihara
OriginalPaper 29 August 2013 Pages: 247 - 258
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions
Jaewon Chang
Sung K. Kang
Hyuck Mo Lee
OriginalPaper 08 October 2013 Pages: 259 - 269
Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing
Tsung-Han Yang
Yu-Min Lin
Fan-Yi Ouyang
OriginalPaper 17 October 2013 Pages: 270 - 276
Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder
Y.J. Hu
Y.C. Hsu
C.Y. Liu
OriginalPaper 29 October 2013 Pages: 277 - 283
Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System
P. Y. Chien
C. H. Yeh
Albert T. Wu
OriginalPaper 19 November 2013 Pages: 284 - 289
Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition
Myung-Won Jung
Sung K. Kang
Jae-Ho Lee
OriginalPaper 30 October 2013 Pages: 290 - 298

Volume 43, Issue 1

Mitigation of Sn Whisker Growth by Small Bi Additions

Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum

Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications

Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

Multiphase Resistivity Model for Magnetic Nanocomposites Developed for High Frequency, High Power Transformation

Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature

High-Frequency Inductor Materials

Texture and Magnetic Properties of Rolled Fe-6.5 wt.%Si Thin Sheets

Soft Magnetic Alloy–Polymer Composite for High-Frequency Power Electronics Application

Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism

Effect of Mo Addition on Structure and Magnetocaloric Effect in γ-FeNi Nanocrystals

Structure–Property Correlations in CoFe–SiO₂ Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques

Characterization of ALD Beryllium Oxide as a Potential High-k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs

Interfacial Reactions of High-Bi Alloys on Various Substrates

Nanomeshed Pt(Au) Transparent Contact to p-GaN of Light-Emitting Diode

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys

Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates

Dissolution and Interfacial Reactions of (Cu,Ni)₆Sn₅ Intermetallic Compound in Molten Sn-Cu-Ni Solders

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples

Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing

Optical Properties of Al_xO_y/Ni/Al_xO_y Multilayered Absorber Coatings Prepared by Reactive DC Magnetron Sputtering

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging

Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures

Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions

Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing

Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System

Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition

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