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Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates

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Abstract

Interfacial reactions between Sn, Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC), and Sn-9 wt.%Zn (SZ) lead-free solders and Fe-42 wt.%Ni (alloy 42) substrates at 240°C, 255°C, and 270°C were investigated in this study. FeSn2, (Fe,Ni, Cu)Sn2, and (Ni,Fe)5Zn21 phases were formed, respectively, at the interface in the Sn/alloy 42, SAC/alloy 42, and SZ/alloy 42 couples. As the reaction time and temperature were increased, the layered intermetallic compound (IMC) assumed two distinct structures, i.e., a thicker layer and a pillar-shaped IMC, in all couples. The IMC thickness of these couples increased with the increase of reaction time and temperature. The IMC thickness was also proportional to the square root of the reaction time. The interfacial reaction mechanism of these couples was diffusion controlled.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, 106, Taiwan, ROC

    Yee-Wen Yen, Yu-Ping Hsieh, Chao-Wei Chiu & Yi-Shan Li

  2. Department of Applied Technology of Living, Ta Hwa Institute of Technology, Hsinchu, 30703, Taiwan, ROC

    Chien-Chung Jao

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  1. Yee-Wen Yen
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  2. Yu-Ping Hsieh
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  3. Chien-Chung Jao
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  4. Chao-Wei Chiu
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  5. Yi-Shan Li
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Correspondence to Yee-Wen Yen.

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Yen, YW., Hsieh, YP., Jao, CC. et al. Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates. J. Electron. Mater. 43, 187–194 (2014). https://doi.org/10.1007/s11664-013-2727-4

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  • DOI: https://doi.org/10.1007/s11664-013-2727-4

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