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Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications

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Abstract

The effects of the Ni(P) thickness δ Ni(P) on the interfacial reaction between an Sn-3Ag-0.5Cu solder and an Au/Pd(P)/Ni(P)/Cu pad (thickness: 0.05/0.05/0.1–0.3/20 μm) and the resulting mechanical properties were investigated using scanning electron microscopy equipped with an electron backscatter diffraction system, a focused ion beam system, electron probe microanalysis, and high-speed ball shear (HSBS) testing. Regardless of δ Ni(P), all of the Au/Pd(P)/Ni(P) surface finishes examined were completely exhausted in one reflow, exposing the Cu pad underneath the solder. Cu6Sn5 dissolved with various Ni contents, termed (Cu,Ni)6Sn5, was the dominant intermetallic compound (IMC) species at the solder/Cu interface. Additionally, Ni2SnP and Ni3P IMCs might form with the (Cu,Ni)6Sn5 in the thick Ni(P) case, i.e., δ Ni(P) = 0.3 μm, and the two IMCs (Ni2SnP and Ni3P) were gradually eliminated from the interface after multiple reflows. A mass balance analysis indicated that the growth of the Ni-containing IMCs, rather than the dissolution of the metallization pad, played a key role in the Ni(P) exhaustion. The HSBS test results indicated that the mechanical strength of the solder joints was also δ Ni(P) dependent. The combined results of the interfacial reaction and the mechanical evaluation provided the optimal δ Ni(P) value for soldering applications.

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Authors and Affiliations

  1. Department of Chemical Engineering and Materials Science, Yuan Ze University, No. 135, Yuan-Tung Road, Chungli, 320, Taoyuan, Taiwan ROC

    C. E. Ho, S. J. Wang, C. W. Fan & W. H. Wu

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  1. C. E. Ho
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  2. S. J. Wang
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  3. C. W. Fan
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  4. W. H. Wu
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Correspondence to C. E. Ho.

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Ho, C.E., Wang, S.J., Fan, C.W. et al. Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications. J. Electron. Mater. 43, 16–25 (2014). https://doi.org/10.1007/s11664-013-2664-2

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  • DOI: https://doi.org/10.1007/s11664-013-2664-2

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