Measurement of Thermal Conductivity Using Steady-State Isothermal Conditions and Validation by Comparison with Thermoelectric Device Performance Patrick J. TaylorJay R. MadduxParvez N. Uppal BriefCommunication 06 July 2012 Pages: 2307 - 2312
Size-Quantization Semimetal–Semiconductor Transition in Bi0.98Sb0.02 Nanowires: Thermoelectric Properties A.A. NikolaevaL.A. KonopkoE.F. Moloshnik OriginalPaper 13 April 2012 Pages: 2313 - 2316
Preparation and Transport Properties of Bi2O2Se Single Crystals C. DrasarP. RuleovaP. Lostak OriginalPaper 03 June 2012 Pages: 2317 - 2321
Thermal Conductivity of InAs/GaSb Type II Superlattice Chuanle ZhouB. -M. NguyenM. Grayson OriginalPaper 06 June 2012 Pages: 2322 - 2325
Thermoelectric Figure of Merit Enhancement in Bi2Te3-Coated Bi Composites T. W. LanY. C. ChenY. Y. Chen OriginalPaper 15 June 2012 Pages: 2326 - 2330
An Investigation of Electrical Contacts for Higher Manganese Silicide Xinghua ShiZahra ZamanipourDaryoosh Vashaee OriginalPaper 27 June 2012 Pages: 2331 - 2337
Thermoelectric and Magnetic Properties of Ca0.98RE0.02MnO3−δ (RE = Sm, Gd, and Dy) Ankam BhaskarChia-Jyi LiuJ.J. Yuan OriginalPaper 23 June 2012 Pages: 2338 - 2344
Effect of the Surface Morphology of Seed and Mask Layers on InP Grown on Si by Epitaxial Lateral Overgrowth Carl JunesandChen HuSebastian Lourdudoss OriginalPaper 23 June 2012 Pages: 2345 - 2349
Energy Relaxation Rates in AlInN/AlN/GaN Heterostructures E. TirasS. ArdaliE. Ozbay OriginalPaper 27 June 2012 Pages: 2350 - 2361
Active Layer Thickness Effects on the On-State Current and Pulse Measurement at Room Temperature on Deposited Zinc Oxide Thin-Film Transistors Sarbani BasuPramod K. SinghYeong-Her Wang OriginalPaper 31 May 2012 Pages: 2362 - 2368
Anodized Macroporous Silicon Anode for Integration of Lithium-Ion Batteries on Chips Xida SunHong HuangYan Zhuang OriginalPaper 06 June 2012 Pages: 2369 - 2375
Effect of Target Density on Microstructural, Electrical, and Optical Properties of Indium Tin Oxide Thin Films Guisheng ZhuLi ZhiAibing Yu OriginalPaper 12 June 2012 Pages: 2376 - 2379
Phosphorus Doping Effect in a Zinc Oxide Channel Layer to Improve the Performance of Oxide Thin-Film Transistors Dong-Suk HanYeon-Keon MoonJong-Wan Park OriginalPaper 19 June 2012 Pages: 2380 - 2386
AC Conductivity and Diffuse Reflectance Studies of Ag-TiO2 Nanoparticles A.K. Abdul GafoorM.M. MusthafaP.P. Pradyumnan OriginalPaper 27 June 2012 Pages: 2387 - 2392
Preparation and Characterization of New Sr5−x La x Nb4−x Ti1+x O17 Microwave Dielectric Ceramics Yaseen IqbalAbdul Manan OriginalPaper 18 April 2012 Pages: 2393 - 2398
Switching Phenomena of Amorphous Ga5Ge15Te80 Chalcogenide Thin Films for Phase-Change Memories G.B. Sakr OriginalPaper 28 June 2012 Pages: 2399 - 2404
Electrical and Optical Investigations on Tungsten-Incorporated CdO Thin Films A.A. Dakhel OriginalPaper 23 June 2012 Pages: 2405 - 2410
Direct Electrosynthesis and Characterization of a New Soluble Polythiophene Derivative Containing Carboxyl Groups in Boron Trifluoride Diethyl Etherate Yu HeWenjuan GuoJunzi Jiang OriginalPaper 22 June 2012 Pages: 2411 - 2418
Failure Causes of a Polymer Resettable Circuit Protection Device Shunfeng ChengKwok TomMichael Pecht OriginalPaper 06 June 2012 Pages: 2419 - 2430
Thermoelectric Performance Enhancement of Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Composite Films by Addition of Dimethyl Sulfoxide and Urea Fangfang KongCongcong LiuZhi Sun OriginalPaper 03 July 2012 Pages: 2431 - 2438
Electrical and Dielectric Properties of Exfoliated Graphite/Polyimide Composite Films with Low Percolation Threshold Li YuYi-He ZhangHai-Tao Huang OriginalPaper 22 June 2012 Pages: 2439 - 2446
Synthesis, Characterization, and Electroluminescent Properties of Pyridinylene Vinylene-Modified Phenylene Vinylene Copolymers Rupei TangWenqing ZhangZhan’ao Tan OriginalPaper 27 June 2012 Pages: 2447 - 2452
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding H. LiuK. WangN. Hoivik OriginalPaper 05 April 2012 Pages: 2453 - 2462
Creep–Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures Kittichai FakpanYuichi OtsukaKazuya Kodani OriginalPaper 05 April 2012 Pages: 2463 - 2469
Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer Hsiao-An PanChi-Pu LinChih-Ming Chen OriginalPaper 06 April 2012 Pages: 2470 - 2477
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints Y. D. HanH. Y. JingJ. Wei OriginalPaper 03 June 2012 Pages: 2478 - 2486
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints Cai ChenLei ZhangJ. K. Shang OriginalPaper 13 June 2012 Pages: 2487 - 2494
Interfacial Reactions in Sn x Zn1−x (Liquid)/Ni(Solid) Couples at 873 K Yuan YuanDajian LiGabriella Borzone OriginalPaper 22 June 2012 Pages: 2495 - 2501
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish Ming-Hui ChuS.W. LiangAnnie T. Huang OriginalPaper 29 June 2012 Pages: 2502 - 2507
Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation Sungwon HanMichael OstermanMichael Pecht OriginalPaper 06 July 2012 Pages: 2508 - 2518
Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate K.E. YazzieJ.J. WilliamsN. Chawla OriginalPaper 06 July 2012 Pages: 2519 - 2526
Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications Li-Ngee HoHiroshi Nishikawa OriginalPaper 15 May 2012 Pages: 2527 - 2532
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication A. HeryantoW.N. PutraK.L. Pey OriginalPaper 26 May 2012 Pages: 2533 - 2542
Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste Tao WangMeihua ZhaoShufang Luo OriginalPaper 31 May 2012 Pages: 2543 - 2552
Ohmic Curing of Printed Silver Conductive Traces D.A. RobersonR.B. WickerE. MacDonald OriginalPaper 01 June 2012 Pages: 2553 - 2566
Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration L. PengD.F. LimC.S. Tan OriginalPaper 12 June 2012 Pages: 2567 - 2572
Effects of Au and Pd Additions on Joint Strength, Electrical Resistivity, and Ion-Migration Tolerance in Low-Temperature Sintering Bonding Using Ag2O Paste Takeyasu ItoTomo OguraAkio Hirose OriginalPaper 19 June 2012 Pages: 2573 - 2579
Performance of Isotropic and Anisotropic Heat Spreaders D.D.L. ChungYoshihiro Takizawa OriginalPaper 28 June 2012 Pages: 2580 - 2587
HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process Cheng-Li ChuangMin-Yi Kang OriginalPaper 23 March 2012 Pages: 2588 - 2598
Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature Hui-wang CuiDong-sheng LiQiong Fan OriginalPaper 10 May 2012 Pages: 2599 - 2605
An Analytical Approach to Determine the Pressure Distribution During Chemical Mechanical Polishing Christian LudwigMeinhard Kuna OriginalPaper 12 June 2012 Pages: 2606 - 2612
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test Jue LiTapio TarvainenMervi Paulasto-Kröckel OriginalPaper 29 June 2012 Pages: 2613 - 2620
Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate Cheng-Li ChuangJong-Ning AohChi-Chuan Pan OriginalPaper 28 June 2012 Pages: 2621 - 2630
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications Dhafer Abdulameer ShnawahSuhana Binti Mohd SaidFa Xing Che ReviewPaper 27 June 2012 Pages: 2631 - 2658
Retraction Note: Single-Phase β-Zn4Sb3 Prepared by a Mechanical Grinding Method Chinatsu OkamuraTakashi UedaKazuhiro Hasezaki Retraction Note 03 July 2012 Pages: 2659 - 2659
