1. Overshoot Graded Layers for Mismatched Heteroepitaxial Devices

   • J.F. Ocampo
   • E. Suarez
   • J.E. Ayers

   OriginalPaper 28 May 2008 Pages: 1035 - 1043

2. Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes

   • W. Wang
   • A. Lin
   • J.D. Phillips

   BriefCommunication 06 June 2008 Pages: 1044 - 1048

3. Optical Properties of Nanocrystalline GaN Films Prepared by Annealing Amorphous GaN in Ammonia

   • Z.X. Zhang
   • X.J. Pan
   • E.Q. Xie

   OriginalPaper 12 June 2008 Pages: 1049 - 1053

4. MOCVD Growth of InN on Si(111) with Various Buffer Layers

   • C.C. Huang
   • R.W. Chuang
   • W.J. Lin

   OriginalPaper 23 May 2008 Pages: 1054 - 1057

5. Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation

   • Qifeng Han
   • Chenghong Duan
   • Yuqi Wang

   OriginalPaper 28 May 2008 Pages: 1058 - 1063

6. Cleaved Mirrors for Nitride Semiconductor Lasers

   • Wei-Li Chen
   • Yi-Cheng Chang

   OriginalPaper 17 June 2008 Pages: 1064 - 1069

7. Characterization of Mg-Doped AlInN Annealed in Nitrogen and Oxygen Ambients

   • A.T. Cheng
   • Y.K. Su
   • S.Y. Kuo

   OriginalPaper 17 June 2008 Pages: 1070 - 1075

8. Growth of GaN Nanowires on Epitaxial GaN

   • D. Aurongzeb
   • D.Y. Song
   • M. Holtz

   OriginalPaper 22 May 2008 Pages: 1076 - 1081

9. Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires

   • Wei Hao Lai
   • Min Hsiung Hon
   • Chu Kun Chen

   BriefCommunication 17 May 2008 Pages: 1082 - 1087

10. Combined Use of Magnetic and Electrically Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding

    • Junhua Wu
    • D.D.L. Chung

    OriginalPaper 31 May 2008 Pages: 1088 - 1094

11. Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking

    • W. Zhang
    • W. Ruythooren

    OriginalPaper 31 May 2008 Pages: 1095 - 1101

12. Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide

    • H.J. Lee
    • Jin Yu

    OriginalPaper 07 May 2008 Pages: 1102 - 1110

13. Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na₂SO₄ Solutions

    • Ja-Young Jung
    • Shin-Bok Lee
    • Young-Bae Park

    OriginalPaper 12 June 2008 Pages: 1111 - 1118

14. Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

    • H.F. Zou
    • Z.F. Zhang

    OriginalPaper 12 June 2008 Pages: 1119 - 1129

15. Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

    • Anupam Choubey
    • Hao Yu
    • Xu Ming

    OriginalPaper 28 May 2008 Pages: 1130 - 1138

16. Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects

    • Seungbae Park
    • Ramji Dhakal
    • Jia Gao

    OriginalPaper 28 May 2008 Pages: 1139 - 1147

17. Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples

    • Kazuyuki Kohama
    • Kazuhiro Ito
    • Masanori Murakami

    OriginalPaper 22 May 2008 Pages: 1148 - 1157

18. Evaluation of Mn Uniformity in CdMnTe Crystal Grown by the Vertical Bridgman Method

    • Jijun Zhang
    • Wanqi Jie
    • Dongmei Zeng

    OriginalPaper 13 May 2008 Pages: 1158 - 1162

19. Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag

    • Jung-Mo Kim
    • Jae-Pil Jung
    • Jong-Hyeong Kim

    Erratum 28 May 2008 Pages: 1163 - 1163