Overshoot Graded Layers for Mismatched Heteroepitaxial Devices J.F. OcampoE. SuarezJ.E. Ayers OriginalPaper 28 May 2008 Pages: 1035 - 1043
Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes W. WangA. LinJ.D. Phillips BriefCommunication 06 June 2008 Pages: 1044 - 1048
Optical Properties of Nanocrystalline GaN Films Prepared by Annealing Amorphous GaN in Ammonia Z.X. ZhangX.J. PanE.Q. Xie OriginalPaper 12 June 2008 Pages: 1049 - 1053
MOCVD Growth of InN on Si(111) with Various Buffer Layers C.C. HuangR.W. ChuangW.J. Lin OriginalPaper 23 May 2008 Pages: 1054 - 1057
Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation Qifeng HanChenghong DuanYuqi Wang OriginalPaper 28 May 2008 Pages: 1058 - 1063
Cleaved Mirrors for Nitride Semiconductor Lasers Wei-Li ChenYi-Cheng Chang OriginalPaper 17 June 2008 Pages: 1064 - 1069
Characterization of Mg-Doped AlInN Annealed in Nitrogen and Oxygen Ambients A.T. ChengY.K. SuS.Y. Kuo OriginalPaper 17 June 2008 Pages: 1070 - 1075
Growth of GaN Nanowires on Epitaxial GaN D. AurongzebD.Y. SongM. Holtz OriginalPaper 22 May 2008 Pages: 1076 - 1081
Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires Wei Hao LaiMin Hsiung HonChu Kun Chen BriefCommunication 17 May 2008 Pages: 1082 - 1087
Combined Use of Magnetic and Electrically Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding Junhua WuD.D.L. Chung OriginalPaper 31 May 2008 Pages: 1088 - 1094
Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking W. ZhangW. Ruythooren OriginalPaper 31 May 2008 Pages: 1095 - 1101
Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide H.J. LeeJin Yu OriginalPaper 07 May 2008 Pages: 1102 - 1110
Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions Ja-Young JungShin-Bok LeeYoung-Bae Park OriginalPaper 12 June 2008 Pages: 1111 - 1118
Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates H.F. ZouZ.F. Zhang OriginalPaper 12 June 2008 Pages: 1119 - 1129
Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging Anupam ChoubeyHao YuXu Ming OriginalPaper 28 May 2008 Pages: 1130 - 1138
Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects Seungbae ParkRamji DhakalJia Gao OriginalPaper 28 May 2008 Pages: 1139 - 1147
Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples Kazuyuki KohamaKazuhiro ItoMasanori Murakami OriginalPaper 22 May 2008 Pages: 1148 - 1157
Evaluation of Mn Uniformity in CdMnTe Crystal Grown by the Vertical Bridgman Method Jijun ZhangWanqi JieDongmei Zeng OriginalPaper 13 May 2008 Pages: 1158 - 1162
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag Jung-Mo KimJae-Pil JungJong-Hyeong Kim Erratum 28 May 2008 Pages: 1163 - 1163