Device Characteristics of GaInSb/AlGaSb Quantum Well Lasers Monolithically Grown on GaAs Substrates by Using an Interfacial Misfit Array J. TatebayashiA. JallipalliD.L. Huffaker OriginalPaper 22 August 2008 Pages: 1758 - 1763
Low-Noise Mid-Wavelength Infrared Avalanche Photodiodes Siddhartha GhoshShubhrangshu MallickSanjay Krishna OriginalPaper 25 September 2008 Pages: 1764 - 1769
2.3-μm High-Power Type I Quantum-Well GaInAsSb/AlGaAsSb/GaSb Laser Diode Arrays with Increased Fill Factor D. DonetskyJ. ChenD. Westerfeld OriginalPaper 17 June 2008 Pages: 1770 - 1773
Optical Properties of Dilute Nitride InN(As)Sb Quantum Wells and Quantum Dots Grown by Molecular Beam Epitaxy S.M. KimH.B. YuenJ.S. Harris OriginalPaper 13 May 2008 Pages: 1774 - 1779
Interband Cascade Lasers with Wavelengths Spanning 2.9 μm to 5.2 μm C.L. CanedyW.W. BewleyJ.R. Meyer OriginalPaper 08 April 2008 Pages: 1780 - 1785
Power Generator Modules of Segmented Bi2Te3 and ErAs:(InGaAs)1−x (InAlAs) x Gehong ZengJe-Hyeong BahkArun Majumdar OriginalPaper 27 March 2008 Pages: 1786 - 1792
GaSb(001) Surface Reconstructions Measured at the Growth Front by Surface X-ray Diffraction B.P. TinkhamO. RomanyukJ. Mizuki OriginalPaper 07 October 2008 Pages: 1793 - 1798
Comparison of MBE Growth of InSb on Si (001) and GaAs (001) T. Lien TranFariba HatamiG.J. Salamo OriginalPaper Open access 07 October 2008 Pages: 1799 - 1805
Enhancement of Spin–Orbit Interaction by Bandgap Engineering in InAs-Based Heterostructures Takashi MatsudaKanji Yoh OriginalPaper 16 October 2008 Pages: 1806 - 1810
Design and Characterization of Fabry–Pérot MEMS-Based Short-Wave Infrared Microspectrometers A.J. KeatingJ. AntoszewskiJ.E. Robinson OriginalPaper 08 August 2008 Pages: 1811 - 1820
Ionic Electrodeposition Simulation of CdTe Thin Films Herng-Yih UengShu-Ying YangJung-Chuan Chou OriginalPaper 17 September 2008 Pages: 1821 - 1827
Cubic HfN Thin Films with Low Resistivity on Si (001) and MgO (001) Substrates Roy A. AraujoXinghang ZhangHaiyan Wang BriefCommunication 16 September 2008 Pages: 1828 - 1831
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates Ho-Young SonGi-Jo JungKyung-Wook Paik OriginalPaper 10 September 2008 Pages: 1832 - 1842
Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au S.L. NgohW. ZhouJ.H.L. Pang OriginalPaper 10 September 2008 Pages: 1843 - 1850
Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection S. ChoiS.Y. HwangW.S. Oh OriginalPaper 16 September 2008 Pages: 1851 - 1857
Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Y.H. XiaY.K. JeeT.Y. Lee OriginalPaper 16 September 2008 Pages: 1858 - 1862
Effect of Microstructural Development on Mechanical and Electrical Properties of Inkjet-Printed Ag Films Inyoung KimYoung Ah SongJongryoul Kim OriginalPaper 19 September 2008 Pages: 1863 - 1868