1. Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint

   • Bo Li
   • Yaowu Shi
   • Bin Zong

   Regular Issue Paper Pages: 217 - 224

2. Electrical properties of titanium-HgCdTe contacts

   • V. Srivastav
   • R. Pal
   • H. P. Vyas

   Regular Issue Paper Pages: 225 - 231

3. Reprocessing of thermally oxidized aluminum arsenide (AlAs) in epitaxial multilayers without delamination

   • L. Hobbs
   • I. Eddie
   • M. Mackenzie

   Regular Issue Paper Pages: 232 - 239

4. Synthesis of silicon dioxide film using high-concentration ozone and evaluation of the film quality

   • Kunihiko Koike
   • Koichi Izumi
   • Shingo Ichimura

   Regular Issue Paper Pages: 240 - 247

5. Real-time scanning electron microscopy and auger spectroscopy of wetting in Sn-3.3Ag-4.8Bi solder paste wetted to Ni-Au

   • M. J. Bozack
   • R. W. Johnson

   Regular Issue Paper Pages: 248 - 265

6. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives

   • Yi Li
   • Kyoung-Sik Moon
   • C. P. Wong

   Regular Issue Paper Pages: 266 - 271

7. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications

   • Chia-Tai Kuo
   • Ming-Chuen Yip
   • Chingfu Tsou

   Regular Issue Paper Pages: 272 - 281

8. Investigation of Ga oxide films directly grown on n-type GaN by photoelectrochemical oxidation using He-Cd laser

   • Ching-Ting Lee
   • Hong-Wei Chen
   • Hsin-Ying Lee

   Regular Issue Paper Pages: 282 - 286

9. Effect of firing atmosphere on air-fireable glass-free electrically conductive thick film

   • Zongrong Liu
   • D. D. L. Chung

   Regular Issue Paper Pages: 287 - 293

10. Electro-thermal resistance of GaAs interconnects

    • Scott A. Wartenberg
    • Gang Zhao
    • Qing H. Liu

    Regular Issue Paper Pages: 294 - 298

11. Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substrates

    • Edwin P. Lopez
    • Paul T. Vianco
    • Jerome A. Rejent

    Regular Issue Paper Pages: 299 - 310

12. Microstructure and mechanical properties predicted by indentation testing of lead-free solders

    • T. Ogawa
    • R. Kaga
    • T. Ohsawa

    Regular Issue Paper Pages: 311 - 317

13. Effect of off-orientation of seed crystal on silicon carbide (SiC) single-crystal growth on the (11\(\bar 2\)0) surface0) surface

    • Masakazu Katsuno
    • Noboru Ohtani
    • Hirokatsu Yashiro

    Erratum Pages: 318 - 318

14. Increase mechanism of indium-tin-oxide work function by KrF excimer laser irradiation

    • Yow-Jon Lin
    • Chou-Wei Hsu
    • Yung-Chi Wang

    Letter Pages: L9 - L11

15. Direct sub-100-nm patterning of an organic low-k dielectric for electrical and optical interconnects

    • Jeffrey M. Catchmark
    • Guy P. Lavallee
    • Youngchul Lee

    Letter Pages: L12 - L15