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Microstructure and mechanical properties predicted by indentation testing of lead-free solders

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Abstract

Microstructure and mechanical properties were investigated for ten systems of lead-free solders compared with the eutectic Sn-Pb solder. Mechanical properties including elastic, plastic, and creep deformations were predicted by indentation testing. This method was established based on the elastic-plastic-creep finite-element method (FEM). The predicted mechanical properties were obtained for the temperatures ranging between −20°C and 160°C.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Aoyama Gakuin University, 229-8558, Kanagawa, Japan

    T. Ogawa, R. Kaga & T. Ohsawa

Authors
  1. T. Ogawa
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  2. R. Kaga
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  3. T. Ohsawa
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Ogawa, T., Kaga, R. & Ohsawa, T. Microstructure and mechanical properties predicted by indentation testing of lead-free solders. J. Electron. Mater. 34, 311–317 (2005). https://doi.org/10.1007/s11664-005-0218-y

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  • DOI: https://doi.org/10.1007/s11664-005-0218-y

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