Solder balling of lead-free solder pastes Minna ArraDongkai ShangguanToivo Lepistö Special Issue Paper Pages: 1130 - 1138
Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system X. J. LiuY. InohanaJ. Pstrus Special Issue Paper Pages: 1139 - 1151
Modeling thermomechanical fatigue behavior of Sn-Ag solder joints J. G. LeeA. TelangT. R. Bieler Special Issue Paper Pages: 1152 - 1159
Lead-free universal solders for optical and electronic devices Hareesh MavooriAinissa G. RamirezSungho Jin Special Issue Paper Pages: 1160 - 1165
Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying I. E. AndersonB. A. CookR. L. Terpstra Special Issue Paper Pages: 1166 - 1174
Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages Jong-Hwan ParkJong-Hyun LeeYong-Seog Kim Special Issue Paper Pages: 1175 - 1180
Damage accumulation under repeated reverse stressing of Sn-Ag solder joints K. C. ChenA. TelangK. N. Subramanian Special Issue Paper Pages: 1181 - 1189
Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys B. A. CookI. E. AndersonR. L. Terpstra Special Issue Paper Pages: 1190 - 1194
Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate R. A. GaglianoG. GhoshM. E. Fine Special Issue Paper Pages: 1195 - 1202
Interfacial microstructure of Pb-free and Pb-Sn solder balls in the ball-grid array package Chin-Su ChiHen-So ChangC. L. Chung Special Issue Paper Pages: 1203 - 1207
The effect of flux chemistry, applied voltage, conductor spacing, and temperature on conductive anodic filament formation W. J. ReadyL. J. Turbini Special Issue Paper Pages: 1208 - 1224
Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions Z. MoserW. GasiorS. Ksiezarek Special Issue Paper Pages: 1225 - 1229
Phenomena of electroless Ni-P and intermetallic-compound stripping and dissolving in Sn-Bi and Sn-Pb solder joints with Au/EN/Cu metallization Chien-Sheng HuangJih-Hung YehJenq-Gong Duh Special Issue Paper Pages: 1230 - 1237
Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints J. S. KangR. A. GaglianoM. E. Fine Special Issue Paper Pages: 1238 - 1243
Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment John N. LalenaNancy F. DeanMartin W. Weiser Special Issue Paper Pages: 1244 - 1249
Textured growth of Cu/Sn intermetallic compounds K. H. PrakashT. Sritharan Special Issue Paper Pages: 1250 - 1255
Failure mechanism of lead-free solder joints in flip chip packages Fan ZhangMing LiWilliam T. Chen Special Issue Paper Pages: 1256 - 1263
Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints C. E. HoL. C. ShiauC. R. Kao Special Issue Paper Pages: 1264 - 1269
Lead-free ball-grid array balls: Production method and properties B. KempfM. GraffM. Rettenmayr Special Issue Paper Pages: 1270 - 1275
High creep resistance tin-based alloys for soldering applications Rodney J. MccabeMorris E. Fine Special Issue Paper Pages: 1276 - 1282
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique W. K. ChoiS. K. KangD. -Y. Shih Special Issue Paper Pages: 1283 - 1291
Studies of the mechanical and electrical properties of lead-free solder joints S. K. KangW. K. ChoiD. Y. Shih Special Issue Paper Pages: 1292 - 1303
Microstructure of a lead-free composite solder produced by an in-situ process Seong-Yong HwangJoo-Won LeeZin-Hyoung Lee Special Issue Paper Pages: 1304 - 1308
