Abstract
The growth of Cu-Sn intermetallic compounds (IMCs) at the molten Pb-Sn solder/Cu interface was studied over a range of temperatures and for a range of solder compositions. Strong peaks of \((10\bar 12)\) and \((10\bar 11)\) planes of η-phase (Cu6Sn5) were detected by x-ray diffraction when the Sn content was high. In the low Sn solder (27Sn-73Pb), the η-phase peaks were absent at the two high temperatures, but the (2 12 0) peak of the ε-phase (Cu3Sn) was prominent. A texture was detected in both layers in \((10\bar 11)\) and (002) pole figures constructed for the η phase and ε phase, respectively. The growth directions were identified to be 〈101〉 and 〈102〉 for the η phase and 〈102〉 and 〈031〉 for the ε phase, normal to the Cu surface. The growth direction does not change with the morphology and the thickness of the IMC layer. The morphology of the η layer varied gradually from a cellular film with a rugged interface to a dense film with a scalloped interface as the Pb content, temperature, and reaction time increased. The ε layer was always dense and nearly planar.
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Prakash, K.H., Sritharan, T. Textured growth of Cu/Sn intermetallic compounds. J. Electron. Mater. 31, 1250–1255 (2002). https://doi.org/10.1007/s11664-002-0017-7
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DOI: https://doi.org/10.1007/s11664-002-0017-7