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Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment

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Abstract

A bismuth-silver alloy (Bi-11wt.%Ag) has been identified as a viable Pb-free power die-attach solder. The alloy has a solidus at 262.5°C and a liquidus at 360°C. It has a shear modulus of 13.28 GPa and an ultimate tensile strength (UTS) of 59 MPa. Bismuth-silver alloys oxidize in air but will solder to nickel, silver, and gold under reducing atmospheres. Germanium may be added in small amounts (≤500 ppm) to improve the wetting. Wire, ribbon, and preform shapes of the alloy have been fabricated by conventional metalworking techniques.

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References

  1. J. Grammatikakis, M. Manolopoulos, V. Katsika, and D. Kostopoulos, Phys. Status Solidi 144A, 317 (1994).

    Google Scholar 

  2. P. Varotsos, Phys Status Solidi 99B, k93 (1980).

  3. A.K. Giri, Mater. Lett. 17, 353 (1993).

    Article  CAS  Google Scholar 

  4. C. Li and P. Wu, Chem. Mater. 13, 4642 (2001).

    Article  CAS  Google Scholar 

  5. H. Baker, ed., ASM Handbook, Vol. 3. Alloy Phase Diagrams (Materials Park, OH: ASM International, 1992), p. 26.

    Google Scholar 

  6. J.N. Lalena, N.F. Dean, and M.W. Weiser, Adv. Packag. 11, 25 (2002).

    CAS  Google Scholar 

  7. T. Shimizu, H. Ishikawa, I. Ohnuma, and K. Ishida, J. Electron. Mater. 28, 1172 (1999).

    Article  CAS  Google Scholar 

  8. J. Cowan, J. Appl. Phys. 34, 926 (1963).

    Article  CAS  Google Scholar 

  9. T.B. Reed, Free Energy of Formation of Binary Compounds: An Atlas of Charts for High-Temperature Chemical Calculations (Cambridge, MA: MIT Press, 1971), pp. 27–28.

    Google Scholar 

  10. Y. Pauleau and J.-C. Remy, J. Less-Common Metals 42, 199 (1975).

    Article  CAS  Google Scholar 

  11. P.T. Vianco and D.R. Frear, JOM 45 (7), 14 (1993).

    CAS  Google Scholar 

  12. O.V. Duchenko and V.I. Dybkov, J. Mater. Sci. Lett. 14, 1725 (1995).

    Article  CAS  Google Scholar 

  13. V.I. Dybkov and O.V. Duchenko, J. Alloys Compounds 234, 295 (1996).

    Article  CAS  Google Scholar 

  14. M.S. Lee, C. Chen, and C.R. Kao, Chem. Mater. 11, 292 (1999).

    Article  CAS  Google Scholar 

  15. H. Fjellvag and S. Furuseth, J. Less-Common Met. 128, 177 (1987).

    Article  Google Scholar 

  16. F. Hagg, Z. Phys. Chem. 6, 280 (1930).

    Google Scholar 

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Authors and Affiliations

  1. Honeywell Electronic Materials, 99216, Spokane, WA

    John N. Lalena, Nancy F. Dean & Martin W. Weiser

Authors
  1. John N. Lalena
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  2. Nancy F. Dean
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  3. Martin W. Weiser
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Lalena, J.N., Dean, N.F. & Weiser, M.W. Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment. J. Electron. Mater. 31, 1244–1249 (2002). https://doi.org/10.1007/s11664-002-0016-8

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  • DOI: https://doi.org/10.1007/s11664-002-0016-8

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