Water bonding of 50-mm-diameter mirror substrates to AlGaInP light-emitting diode wafers R. H. HorngD. S. WuuJ. S. Liu Special Issue Paper Pages: 907 - 910
Shallow junction formation on p-like CdTe crystals by indium diffusion using excimer laser annealing M. NiraulaA. NakamuraY. Hatanaka Special Issue Paper Pages: 911 - 916
Characterization of sputtered Ta-C-N film in the Cu/barrier/Si contact system Shui Jinn WangHao Yi TsaiM. H. Shiao Special Issue Paper Pages: 917 - 924
Oxygen and indium diffusion into SiO2 encapsulated polycrystalline CdSe films R. M. LangfordM. J. LeeT. J. Tate Special Issue Paper Pages: 925 - 930
Effect of thermal oxide on the crystallization of the anodic Ta2O5 film Yuri Pozdeev-FreemanAlexander Gladkikh Special Issue Paper Pages: 931 - 936
Fluxless wetting propeities of one-side-coated under bump metallurgy and top surface metallurgy Soon-Min HongJae-Yong ParkChoon-Sik Kang Special Issue Paper Pages: 937 - 944
AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging T. H. ChuangY. T. HuangL. C. Tsao Special Issue Paper Pages: 945 - 950
Zn doping of InP, InAsP/InP, and InAsP/InGaAs heterostructures through metalorganic vapor phase diffusion (MOVPD) K. VanhollebekeM. D'HondtP. Demeester Special Issue Paper Pages: 951 - 959
Thermal and mechanical separations of silicon layers from hydrogen pattern-implanted wafers C. H. YunN. W. Cheung Special Issue Paper Pages: 960 - 964
Study of optical and electrical properties of AlxGa1−xSb grown by metalorganic chemical vapor deposition A. H. RamelanK. Drozdowicz-TomsiaT. L. Tansley Special Issue Paper Pages: 965 - 971
Dopant diffusion and current-voltage studies on epitaxial InP codoped with Ru and Fe D. SöderströmS. LourdudossH. Schumann Special Issue Paper Pages: 972 - 976
Indium doping effect on GaN in the initial growth stage Hairong YuanDa-Cheng LuPeide Han Special Issue Paper Pages: 977 - 979
Microstructure and properties of aluminum contacts formed on GaAs(100) by low pressure chemical vapor deposition with dimethylethylamine alane source V. ShashkinS. RushworthN. Vostokov Special Issue Paper Pages: 980 - 986
Epitaxially regrown GaAs/AlGaAs laser mesas with semi-insulating GaInP:Fe and GaAs:Fe C. Angulo BarriosE. Rodriguez MessmerS. Lourdudoss Special Issue Paper Pages: 987 - 991
Dye-sensitized solid-state photovoltaic cells: Suppression of electron-hole recombination by deposition of the dye on a thin insulating film in contact with a semiconductor K. TennakoneV. P. S. PereraA. Konno Special Issue Paper Pages: 992 - 996
Correlation between intermetallic thickness and roughness during solder reflow A. S. ZuruziS. K. LahiriK. S. Siow Special Issue Paper Pages: 997 - 1000
Effects of metallization characteristics on gold wire bondability of organic printed circuit boards Jang-Kyo KimBenny P. L. Au Special Issue Paper Pages: 1001 - 1011
Weldability of thin sheet metals by small-scale resistance spot welding using high-frequency inverter and capacitor-discharge power supplies Y. ZhouS. J. DongK. J. Ely Special Issue Paper Pages: 1012 - 1020
Correlation between excess Si atoms near the ultrathin silicon oxide-Si(100) interface and oxidation temperature Hiroshi Yamada Special Issue Paper Pages: 1021 - 1027
The effect of carrier gas and H(hfac) on MOCVD Cu films using (hfac)Cu(1,5-COD) as a precursor W. H. LeeY. K. KoJ. G. Lee Special Issue Paper Pages: 1028 - 1034
Ethylene glycol ether free solder paste development Bill LytleTreliant FangCharles Zhang Special Issue Paper Pages: 1035 - 1041
Microstructure control of copper films by the addition of molybdenum in an advanced metallization process W. H. LeeY. K. KoJ. G. Lee Special Issue Paper Pages: 1042 - 1048