Rapid thermal nitridation of thin SiO2 films D. HenscheidM. N. KozickiR. J. Graham OriginalPaper Pages: 99 - 104
Low resistivep-type ZnSe: A key for an efficient blue electroluminescent device N. StücheliE. Bucher OriginalPaper Pages: 105 - 109
Growth condition dependence for GaAs selective epitaxial growth by molecular beam epitaxy A. OkamotoK. Ohata OriginalPaper Pages: 111 - 115
Effect of inherent deformations of leadframes on bleedability of plastic dip S. L. KerkS. C. TayS. J. Hu OriginalPaper Pages: 117 - 121
Halogen lamp rapid thermal annealing of Si- and Be-implanted In0.53Ga0.47As Mulpuri V. RaoSadanand M. GulwadiOlaleye A. Aina OriginalPaper Pages: 131 - 136
Investigation of the interface region produced by molecular beam epitaxial regrowth D. BiswasP. R. BergerP. K. Bhattacharya OriginalPaper Pages: 137 - 142
The effect of ion-implantation damage on dopant diffusion in silicon during shallow-junction formation Yudong KimHisham Z. MassoudRichard B. Fair OriginalPaper Pages: 143 - 150
Effects of melt composition on deep electronic states and compensation ratios inn-type LEC gallium arsenide R. FornariE. GombiaR. Mosca OriginalPaper Pages: 151 - 155
The effects of thermal annealing on the microstructural, optical and electrical properties of beta silicon carbide films implanted with boron or nitrogen J. RyuH. J. KimR. F. Davis OriginalPaper Pages: 157 - 165
MIM capacitor fabrication and assessment for GaAs MMICs J. P. NagleS. P. S. SanghaP. J. West OriginalPaper Pages: 167 - 169
Electrically active defects in shallow pre-amorphisedp + n junctions in silicon S. D. BrothertonJ. R. AyresJ. P. Gowers OriginalPaper Pages: 173 - 184
Structural and electrical properties ofn-type bulk gallium arsenide grown from non-stoichiometric melts R. FornariC. FrigeriR. Gleichmann OriginalPaper Pages: 185 - 189
Automated and calibrated whole wafer etch pit density measurements in GaAs J. S. SewellS. C. DudleyD. C. Walters OriginalPaper Pages: 191 - 197
Metastable defect structures in elemental and compound semiconductors J. L. Benton OriginalPaper Pages: 199 - 206
DX centers in Sn-doped Ga0.7Al0.3As T. M. HayesD. L. WilliamsonA. Rudra OriginalPaper Pages: 207 - 208
Observation of differences in the quenching of the Photocurrent in GaAs containing EL2 and EL0 W. C. MitchelLaura S. ReaP. W. Yu OriginalPaper Pages: 209 - 213
Materials for high-density electronic packaging and interconnections in the higher packaging levels C. A. Neugebauer OriginalPaper Pages: 229 - 239
An overview of laminate materials with enhanced dielectric properties Stephen J. Mumby OriginalPaper Pages: 241 - 250
Comparison of superconducting and normal conducting high speed interconnections at 80 K F. Lange OriginalPaper Pages: 251 - 257
Integrated optoelectronic materials and circuits for optical interconnects L. D. Hutcheson OriginalPaper Pages: 259 - 265
Thermal analysis of a multi-chip package design Robert DarveauxLih-Tyng HwangIwona Turlik OriginalPaper Pages: 267 - 274
High resolution optical interference investigation of deformation due to thermal expansion mismatch around plated through holes in multilayer circuit boards D. A. TossellK. H. G. Ashbee OriginalPaper Pages: 275 - 286
Dielectric properties of FR-4 laminates as a function of thickness and the electrical frequency of the measurement Stephen J. MumbyJih Yuan OriginalPaper Pages: 287 - 292
High rate magnetron RIE of thick polyimide films for advanced computer packaging applications Giora J. DishonStephen M. BobbioRussell F. Jewett OriginalPaper Pages: 293 - 299
The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging N. MajidS. DabralJ. F. McDonald OriginalPaper Pages: 301 - 311
Polyimidesiloxanes: Emerging materials for advanced packaging applications Chung J. Lee OriginalPaper Pages: 313 - 318
A copper/polyimide Metal-base packaging technology Hayato TakasagoKohei AdachiMitsuyuki Takada OriginalPaper Pages: 319 - 326
Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy Goran MatljasevicChin C. Lee OriginalPaper Pages: 327 - 337
The role of electrochemical migration and moisture adsorption on the reliability of metallized ceramic substrates Garry W. WarrenPaul WynblattMehrooz Zamanzadeh OriginalPaper Pages: 339 - 353