Volume 1 2011

MEMS Materials and Processes Handbook

Editors:

ISBN: 978-0-387-47316-1 (Print) 978-0-387-47318-5 (Online)

Table of contents (14 chapters)

  1. Front Matter

    Pages i-xxxv

  2. No Access

    Book Chapter

    Pages 1-36

    The MEMS Design Process

  3. No Access

    Book Chapter

    Pages 37-136

    Additive Processes for Semiconductors and Dielectric Materials

  4. No Access

    Book Chapter

    Pages 137-191

    Additive Processes for Metals

  5. No Access

    Book Chapter

    Pages 193-271

    Additive Processes for Polymeric Materials

  6. No Access

    Book Chapter

    Pages 273-353

    Additive Processes for Piezoelectric Materials: Piezoelectric MEMS

  7. No Access

    Book Chapter

    Pages 355-402

    Materials and Processes in Shape Memory Alloy

  8. No Access

    Book Chapter

    Pages 403-456

    Dry Etching for Micromachining Applications

  9. No Access

    Book Chapter

    Pages 457-665

    MEMS Wet-Etch Processes and Procedures

  10. No Access

    Book Chapter

    Pages 667-753

    MEMS Lithography and Micromachining Techniques

  11. No Access

    Book Chapter

    Pages 755-815

    Doping Processes for MEMS

  12. No Access

    Book Chapter

    Pages 817-877

    Wafer Bonding

  13. No Access

    Book Chapter

    Pages 879-923

    MEMS Packaging Materials

  14. No Access

    Book Chapter

    Pages 925-1044

    Surface Treatment and Planarization

  15. No Access

    Book Chapter

    Pages 1045-1181

    MEMS Process Integration

  16. Back Matter

    Pages 1183-1187