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MEMS Materials and Processes Handbook pp 403–456Cite as

Dry Etching for Micromachining Applications

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Part of the book series: MEMS Reference Shelf ((MEMSRS,volume 1))

Abstract

Dry etching processes provide the tools to machine precision high-aspect-ratio structures that form the basic building blocks of microelectromechanical systems. Dry etching processes consist of (1) purely chemical (spontaneous gas phase etching), (2) purely physical (ion beam etching or ion milling), and (3) a combination of both methods (reactive ion or plasma etching) for the controlled removal of desired substrate materials. Although some of the pioneering work in the field was performed as early as the 1970s and 1980s, the area of plasma etching has continued to evolve due to the continuing technological developments in high-density plasma sources, high-throughput vacuum pumps, and process control and instrumentation. Excellent reviews are currently available that provide details in various aspects of the technology and etching process development. This chapter is aimed at providing the reader with a broad understanding of the parameters that influence the results in dry etching techniques and to provide information that is useful to explore dry etching processes for the fabrication of next-generation MEMS devices. Practical recipes suitable for most commonly used plasma reactor configurations are provided and motivated in terms of the influence of the various control parameters and chemicals (gases used). Because process parameters can rarely be transferred directly across equipment or fabrication facilities, it is important to be able to tune the process parameter to specific process flow requirements and constraints. The material presented is not necessarily exhaustive, but focuses instead on practical issues to tackle for the development of dry etching processes suitable for MEMS applications across a broad range of materials.

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Acknowledgment

The author (ST) would like to thank the graduate students Steven Gross, Han Guen Yu, Abhijat Goyal, Saliya Subasinghe, and Ping Kao in the group and Guy Lavallee and Changjun Huang at the Pennsylvania State University (PSU) Nanofabrication facility. ST acknowledges the use of facilities at the PSU Site of the NSF NNIN under Agreement 0335765. ST also acknowledges financial support from the US Army Research Office (Grant # W911NF-07-1-0327) and NSF (Grant # 0925438).

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Authors and Affiliations

  1. Department of Electrical Engineering, The Pennsylvania State University, University Park, PA, USA

    Srinivas Tadigadapa

  2. Materials Research Institute, The Pennsylvania State University, University Park, PA, USA

    Srinivas Tadigadapa

  3. Robert Bosch GmbH, Corporate Research Microsystems, Stuttgart, Germany

    Franz Lärmer

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Correspondence to Srinivas Tadigadapa .

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    Reza Ghodssi

  2. Xerox Research Center, Phillips Road 147-16C, Dock 140 800, Webster, 20742, New York, USA

    Pinyen Lin

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Tadigadapa, S., Lärmer, F. (2011). Dry Etching for Micromachining Applications. In: Ghodssi, R., Lin, P. (eds) MEMS Materials and Processes Handbook. MEMS Reference Shelf, vol 1. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-47318-5_7

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