Ancient iron and bronze pieces from La Tejada: Characterization studies José María Gómez de SalazarMaria Isabel BarrenaAlicia Soria Feature Pages: 14 - 16
Global perspectives on electronic materials: Challenges and opportunities Warren H. Hunt Jr. Industrial Insight Pages: 17 - 21
Nanomaterials in nanoelectronics: Who’s who and what’s next Mindy N. Rittner Economics Pages: 22 - 26
Carbon nanotubes and other fullerene-related nanocrystals in the environment: A TEM study L. E. MurrK. F. SotoD. A. Ramirez Research Summary Pages: 28 - 31
Lead-Free solders and processing issues relevant to microelectronics packaging Raymond A. Fournelle Commentary Pages: 33 - 33
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying Sung K. KangDa-Yuan ShihWon K. Choi Research Summary Pages: 34 - 38
The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging Keun-Soo KimKatsuaki SuganumaJong-Min Kim Research Summary Pages: 39 - 43
Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum Tae Hyun KimYoung-Ho Kim Research Summary Pages: 45 - 49
Creep deformation behavior of Sn-3.5Ag solder at small length scales M. KerrN. Chawla Research Summary Pages: 50 - 54