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Lead-Free solders and processing issues relevant to microelectronics packaging

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  • Lead-Free Solder
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References

  1. http://www.icer.org.uk.

  2. “Directive 2002/95/EC,” Official Journal of European Union (13 February 2003).

  3. Special Issue on Packaging and Soldering Technologies for Electronic Interconnects, Journal of Electronic Materials, 29 (10) (2000), pp. 1111–1298.

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  6. Lead-Free Solder section, JOM, 54 (6) (2002), pp. 25–40.

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  7. Special Issue on Lead-Free Solders and Processing Issues in Microelectronic Packaging, Journal of Electronic Materials, 31 (11) (2002), pp. 1129–1308.

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  9. Special Issue on Lead-Free Solders and Processing Issues in Microelectronic Packaging. Journal of Electronic Materials, 32 (12) (2003), pp. 1359–1522.

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Authors and Affiliations

  1. the Department of Mechanical and Industrial Engineering at Marquette University, Milwaukee, Wisconsin

    Raymond A. Fournelle (a professor, the advisor to JOM)

  2. the Electronic Packaging & Interconnection Materials Committee of the Electronic, Magnetic, & Photonic Materials Division of TMS, USA

    Raymond A. Fournelle (a professor, the advisor to JOM)

Authors
  1. Raymond A. Fournelle
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Fournelle, R.A. Lead-Free solders and processing issues relevant to microelectronics packaging. JOM 56, 33 (2004). https://doi.org/10.1007/s11837-004-0107-5

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  • DOI: https://doi.org/10.1007/s11837-004-0107-5

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