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Global perspectives on electronic materials: Challenges and opportunities

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Abstract

Worldwide cooperation is necessary for continued progress in electronic materials to meet the increasing demands of the information technology age. To stay on the current trajectory of performance improvement, fundamental technology barriers must be overcome to further increase memory capacity and microprocessor speed while simultaneously driving down cost. This article describes several global initiatives to promote advancement in electronic materials technologies.

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References

  1. G.E. Moore, “Cramming More Components onto Integrated Circuits,” Electronics, 38 (3) (April 19, 1965), ftp://download.intel.com/research/silicon/moorespaper.pdf.

  2. “Sustaining the Nation’s Innovation Ecosystems, Information Technology Manufacturing and Competitiveness,” President’s Council of Advisors on Science and Technology (16 January 2004), www.ostp.gov/PCAST/FINALPCASTITManuf%20ReportPackage.pdf.

  3. International Technology Roadmap for Semiconductors (San Jose, CA: Semiconductor Industry Association, 2003), http://public.itrs.net/Files/2003ITRS/Home2003.htm.

  4. The International Technology Roadmap for Semiconductors (San Jose, CA: Semiconductor Industry Association, January 27, 2004), www.siaonline.org/backgrounders_itrs.cfm.

  5. “2004 R&D Funding Forecast,” R&D Magazine (January 2004), pp. F1–F15.

  6. G. Scalise, “Crisis in Research and Development Rx for Economic Health? Money for R & D,” San Francisco Chronicle (24 October 2002).

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Authors and Affiliations

  1. TMS, USA

    Warren H. Hunt Jr. (technical consultant)

Authors
  1. Warren H. Hunt Jr.
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Editor’s Note: A hypertext-enhanced version of this article is available on-line at www.tms.org/pubs/journals/JOM/0406/Hunt-0406.html

For more information, contact W.H. Hunt, Jr., TMS, 184 Thorn Hill Road, Warrendale, PA 15086; e-mail whunt@tms.org.

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Hunt, W.H. Global perspectives on electronic materials: Challenges and opportunities. JOM 56, 17–21 (2004). https://doi.org/10.1007/s11837-004-0104-8

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  • DOI: https://doi.org/10.1007/s11837-004-0104-8

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