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The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

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  • Lead-Free Solder
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Abstract

The formation of solidification defects in lead-free soldering is greatly influenced by material factors as well as the design of circuit assemblies. To establish ideal processing conditions and design concepts for sound soldering structures, defect formation in Sn-Ag-Cu for various types of circuit assemblies must be understood. In this study, the solidification process of Sn-3Ag-0.5Cu solder balls on circuit boards for a chip-scale package was examined primarily by using an in-situ solidification observation system with the aid of the solidification simulation. Microstructural observations were also carried out on soldered joints to support those observations and simulations. The experimental results correlate with the simulation results.

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Author information

Authors and Affiliations

  1. the Institute of Scientific and Industrial Research at Osaka University, Osaka, Japan

    Keun-Soo Kim, Katsuaki Suganuma & Chi-Won Hwang

  2. the Institute of Technology and Science, College of Engineering at Chung-Ang University, Seoul, Korea

    Jong-Min Kim

Authors
  1. Keun-Soo Kim
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  2. Katsuaki Suganuma
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  3. Chi-Won Hwang
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  4. Jong-Min Kim
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Additional information

Editor’s Note: Some of the figures in this article were captured from video clips during in-situ observation. Although these figures do not reflect JOM’s usual standards for publication, they are considered essential illustrations of this work.

For more information, contact Keun-Soo Kim, Osaka University, Institute of Scientific and Industrial Research, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan; +81-6-6879-8521; fax +81-6-6879-8522; e-mail kskimm12@sanken.osaka-u.ac.jp.

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Kim, KS., Suganuma, K., Hwang, CW. et al. The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging. JOM 56, 39–43 (2004). https://doi.org/10.1007/s11837-004-0109-3

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  • DOI: https://doi.org/10.1007/s11837-004-0109-3

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