Interfacial Chemistry of InP/GaAs Bonded Pairs N. LiuT.F. Kuech OriginalPaper 30 March 2007 Pages: 179 - 190
Understanding the Effects of Stress on the Crystallization of Amorphous Silicon Li CaiMin ZouWilliam Brown Regular Issue Paper 06 February 2007 Pages: 191 - 196
Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C S.-W. ChenC.-N. ChiuK.-C. Hsieh Regular Issue Paper 10 April 2007 Pages: 197 - 206
Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies J.W. JangJ.K. LinD.R. Frear OriginalPaper 13 April 2007 Pages: 207 - 213
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds M.E. WilliamsK.-W. MoonA.D. Deal OriginalPaper 08 February 2007 Pages: 214 - 219
Microstructure of External Stress Whiskers and Mechanical Indentation Test Method Hiroyuki MoriuchiYoshihiro TadokoroNoboru Suzuki OriginalPaper 16 February 2007 Pages: 220 - 225
Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages D.C.C. LamJ. Wang OriginalPaper 04 April 2007 Pages: 226 - 231
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies O. NOUSIAINENJ. PUTAALAJ. VÄHÄKANGAS Regular Issue Paper 08 February 2007 Pages: 232 - 241
A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric Swapan K. BhattacharyaMahesh G. VaradarajanRao R. Tummala OriginalPaper 06 February 2007 Pages: 242 - 244
Synthesis of Nanometric-Sized Barium Titanate Powders Using Acetylacetone as the Chelating Agent in a Sol-Precipitation Process Kun Ming HungChing Shieh HsiehHui Ju Tsai OriginalPaper 07 February 2007 Pages: 245 - 252
Memory Effect of Metal-Insulator-Silicon Capacitor with HfO2-Al2O3 Multilayer and Hafnium Nitride Gate Shi-Jin DingMin ZhangLi-Kang Wang Letter 29 March 2007 Pages: 253 - 257
Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects S. TsukimotoT. KabeM. Murakami OriginalPaper 11 April 2007 Pages: 258 - 265