Abstract
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To determine if interfacial IMC is a requirement for whisker growth, bright Sn and a Sn-Cu alloy were electroplated on a tungsten (W) substrate that does not form interfacial IMC with the Sn or Cu. At room temperature, conical Sn hillocks grew on the pure Sn deposits and Sn whiskers grew from the Sn-Cu alloy electrodeposits. These results demonstrate that interfacial IMC is not required for initial whisker growth.
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References
Arnold S.M. (1966) Plating 53:96
The Restriction of the Use of Certain Hazardous Substances (RoHS) in Electrical and Electronic Equipment Regulations, July 1, 2006, website http://www.rohs.gov.uk/Docs/uksi_ 20061463_en1.pdf (2006)
NASA Goddard Space Flight Center Tin Whisker (and Other Metal Whisker) Homepage, website http://nepp.nasa.gov/whisker/ (2006)
Fisher R.M., Darken L.S., Carroll K.G. (1954) Acta Metall. 2:368
Dunn B.D. (1976) Circuit World 2:32
Xu C. (2005) IEEE Trans. Electron. Packag. 28:31
Vagramyan A.T., Soloveva Z.A. (1961) Technology of Electrodeposition. English translation, Teddington, England
Lee B.Z., Lee D.N. (1998) Acta Mater. 46:3701
Tu K.N. (1994) Phys. Rev. B: Condens. Mater. 49:2030
Boettinger W.J. et␣al. (2005) Acta Mater. 53:5033
Pearson Handbook of Crystallographic Data for Intermetallic Phases, 2nd ed. (Materials Park, OH: ASM International, 1991)
Binary Alloy Phase Diagrams, 2nd ed., ed. Massalski (Materials Park, OH: ASM International, 1990), vol. 3, p. 3411
U.R. Kattner (unpublished research, NIST, 2005)
Bard A.J., Faulkner L.R. (2001) Electrochemical Methods: Fundamentals and Applications. 2nd ed. New York: Wiley, pp. 337
Anderson R., Klepeis S.J. (2005) In: Giannuzzi L., Stevie F. (eds) Practical Aspects of FIB TEM Specimen Preparation, Introduction to Focused Ion Beams; Instrumentation, Theory, Techniques and Practice, New York: Springer, pp. 173–200
Sheng G.T., Hu C.F., Choi W.J., Tu K.N., Bong Y.Y., Nguyen L. (2002) J. Appl. Phys. 92:64
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Williams, M., Moon, KW., Boettinger, W. et al. Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds. J. Electron. Mater. 36, 214–219 (2007). https://doi.org/10.1007/s11664-006-0071-7
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DOI: https://doi.org/10.1007/s11664-006-0071-7