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A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric

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To realize embedded resistors on multilayer benzocyclobutene (BCB) either on-chip or on-board, a low-cost large format electroless process for deposition of NiP and NiWP thin-film resistors using both low-temperature (25°C) and high-temperature (90°C) baths has been developed. The electroless process exhibits uniform resistor thickness in the submicron range and offers low profile and excellent adhesion to the BCB dielectric layer. The resistor films also act as a seed layer for direct electroplating of copper traces. The NiP alloys can also be tailored to a variable temperature coefficient of resistance (TCR) with different alloy compositions. The electroless process can be adopted in the PCB manufacturing industries with no additional investment. This article is the first report on electroless plated thin film resistors on low loss BCB dielectric.

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References

  1. S. Bhattacharya, R. Tummala, J. Mater. Sci., Mater. Electron. 11, 253 (2000)

    Article  CAS  Google Scholar 

  2. K.J. Lee et␣al. (Paper presented at IEEE-CPMT Int. Symp. Exhib. on Advanced Packaging Materials, Irvine, CA, Mar. 16–18, 2005)

  3. R. Ulrich, L. Schaper, Integrated Passive Component Technology (New York: IEEE Press, 2003)

    Google Scholar 

  4. I. Koiwa, M. Usada, T. Osaka, J. Electrochem. Soc. 137, 1222 (1990)

    Article  Google Scholar 

  5. H. Aoki, IEICE Trans. E 74, 2049 (1991)

    Google Scholar 

  6. H. Sawai, T. Kanamori, I. Koiwa, S. Shibata, K. Nihei, J. Electrochem. Soc. 137, 3653 (1990)

    Article  CAS  Google Scholar 

  7. P. Chahal, R. Tummala, M. Allen, and G. White, Electroless Ni-P and Ni-W-P Thin Film Resistors for MCM-L Based Technologies (ECTC, 1998), pp. 232–239

  8. S. Dhar, S. Chakrabarti, Semicond. Sci. Technol. 11, 1231 (1996)

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, 30332-0560, USA

    Swapan K. Bhattacharya, Mahesh G. Varadarajan, Premjeet Chahal, Gopal C. Jha & Rao R. Tummala

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  1. Swapan K. Bhattacharya
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  2. Mahesh G. Varadarajan
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  3. Premjeet Chahal
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  4. Gopal C. Jha
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  5. Rao R. Tummala
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Correspondence to Swapan K. Bhattacharya.

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Bhattacharya, S.K., Varadarajan, M.G., Chahal, P. et al. A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric. J. Electron. Mater. 36, 242–244 (2007). https://doi.org/10.1007/s11664-006-0058-4

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  • DOI: https://doi.org/10.1007/s11664-006-0058-4

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