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Investigation of Grinding and Lapping Surface Damage Evolution of Fused Silica by Inductively Coupled Plasma Etching

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Abstract

Surface damage has great influence on optical properties, especially the laser-induced damage threshold of optics, and it has become a difficult and basic issue to find suitable methods to efficiently remove the surface damage for improving the surface quality. In this paper, the characteristic evolution of brittle scratch and ground/lapped surface damage during inductively coupled plasma etching (ICPE) process are experimentally investigated on fused silica. Results of damage removal tests show ICPE can efficiently remove brittle scratch and eliminate the lateral and medial cracks. The PV (peak to valley) and RMS (root mean square) values of surface roughness increase with the exposure of lateral and medial cracks, and then gradually decreases with further etching. Finally, the ground and lapped fused silica surfaces with a size of 300 × 300 × 20 mm3 are efficiently processed by ICPE. The power spectral density analysis further demonstrates that the damage can be efficiently removed by ICPE. This study reveals the damage evolution during ICPE process and also provides technical guidance for optimizing the efficient damage removal process to rapidly improve surface quality, precision and fabrication efficiency of fused silica optics.

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Abbreviations

ICPE:

Inductively coupled plasma etching

SSD:

Subsurface damage

MRF:

Magnetorheological finishing

MRR:

Material removal rate

HFE:

Hydrofluoric acid etching

IBF:

Ion beam figuring

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Acknowledgements

This research work was supported by Natural Science Foundation of China (51835013, U1801259), Natural Science Foundation of Hunan Province (2017JJ1004).

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Authors and Affiliations

  1. College of Intelligent Science, National University of Defense Technology, 109 Deya Road, Changsha, 410073, China

    Zuocai Dai, Shanyong Chen, Xuhui Xie & Lin Zhou

  2. Hunan Key Laboratory of Ultra-precision Machining Technology, Changsha, 410073, Hunan, China

    Zuocai Dai, Shanyong Chen, Xuhui Xie & Lin Zhou

  3. Laboratory of Science and Technology on Integrated Logistics Support, National University of Defense Technology, Changsha, 410073, China

    Zuocai Dai, Shanyong Chen, Xuhui Xie & Lin Zhou

Authors
  1. Zuocai Dai
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  2. Shanyong Chen
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  4. Lin Zhou
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Correspondence to Shanyong Chen.

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Dai, Z., Chen, S., Xie, X. et al. Investigation of Grinding and Lapping Surface Damage Evolution of Fused Silica by Inductively Coupled Plasma Etching. Int. J. Precis. Eng. Manuf. 20, 1311–1323 (2019). https://doi.org/10.1007/s12541-019-00142-9

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  • DOI: https://doi.org/10.1007/s12541-019-00142-9

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