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Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging

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Zn additions to Cu under bump metallurgy (UBM) in solder joints were the subject of this study. An alternative design was implemented to fabricate pure Sn as the solder and Cu-xZn (x = 15 wt.% and 30 wt.%) as the UBM to form the reaction couple. As the Zn content increased from 15 wt.% to 30 wt.% in the Sn/Cu-Zn system, growth of both Cu3Sn and Cu6Sn5 was suppressed. In addition, no Kirkendall voids were observed at the interface in either Sn/Cu-Zn couple during heat treatment. After 40-day aging, different multilayered phases of [Cu6Sn5/Cu3Sn/Cu(Zn)] and [Cu6Sn5/Cu(Zn,Sn)/CuZn] formed at the interface of [Sn/Cu-15Zn] and [Sn/Cu-30Zn] couples, respectively. The growth mechanism of intermetallic compounds (IMCs) during aging is discussed on the basis of the composition variation in the joint assembly with the aid of electron-microscopic characterization and the Sn-Cu-Zn ternary phase diagram. According to these analyses of interfacial morphology and IMC formation in the Sn/Cu-Zn system, Cu-Zn is a potential UBM for retarding Cu pad consumption in solder joints.

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Acknowledgements

Financial support of this study is from the National Science Council, Taiwan, under Contract No. NSC-97-2221-E-007-021-MY3.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan

    Chi-Yang Yu, Kai-Jheng Wang & Jenq-Gong Duh

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  1. Chi-Yang Yu
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  2. Kai-Jheng Wang
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  3. Jenq-Gong Duh
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Correspondence to Jenq-Gong Duh.

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Yu, CY., Wang, KJ. & Duh, JG. Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging. J. Electron. Mater. 39, 230–237 (2010). https://doi.org/10.1007/s11664-009-0992-z

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  • DOI: https://doi.org/10.1007/s11664-009-0992-z

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