Abstract
Two specific examples of the new lead-free alloys are described. In the Sn-3.5%Ag-l%Zn alloy (m.p.~217°C), the eutectic precipitate morphology is refined by the relatively small amount of zinc addition and as a result, a high-strength, high-ductility solder with significantly improved creep resistance is obtained. As a temperature equivalent drop-in replacement for the Pb-Sn eutectic alloy (m.p.~183°C), Sn-Zn-In based alloys (m.p.~185°C) have been developed. The addition of indium to the Sn-Zn binary system improves the wetting characteristics of the alloy and lowers the melting temperature.
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References
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McCormack, M., Jin, S. New, lead-free solders. J. Electron. Mater. 23, 635–640 (1994). https://doi.org/10.1007/BF02653349
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DOI: https://doi.org/10.1007/BF02653349