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High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys

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Abstract

In this paper, the impact performance of the novel Fe and Bi added Sn-1Ag-0.5Cu solders has been thoroughly evaluated under severe thermal aging at 200 °C temperature for 100, 200 and 300 h. Impact absorbed energy was determined using Charpy impact testing machine having a 5.4 m/s impact speed. The impact absorbed energy increased from 8.1 to 9.7 J with 0.05 wt.% Fe and 1 wt.% Bi addition to SAC105, raising by about 20%. With the increase in Bi content, the impact energy of the alloy did not further increase. The changes in the impact absorbed energies were corroborated by the corresponding modulus of toughness. Microstructure study via optical microscopy as well as field emission scanning electron microscopy showed that Bi reduces the sizes of the β-Sn dendrites as well as IMCs particles (Ag3Sn and Cu6Sn5) and, thereby, strengthens the alloy. These microstructural modifications improve the strength but decrease the ductility and, as a result, influence the impact toughness of the alloys. The microstructures of Fe and Bi added SAC105 solder alloys showed better stability than SAC105 during high thermal aging due to the Fe and Bi presence in the solder, which then led to their mechanical stability during severe thermal aging.

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Acknowledgements

The authors acknowledge the financial support granted by University of Malaya under UMRG Grants project No: RP003B/13AET and RP014B/13AET, and under PPP grant project No: PG184-2015B.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    Bakhtiar Ali, Mohd Faizul Mohd Sabri, Nazatul Liana Sukiman & Iswadi Jauhari

  2. Department of Electrical Engineering, Faculty of Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    Suhana Mohd Said & Norhayati Soin

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  1. Bakhtiar Ali
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  2. Mohd Faizul Mohd Sabri
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Correspondence to Mohd Faizul Mohd Sabri.

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Ali, B., Sabri, M.F.M., Said, S.M. et al. High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys. J Mater Sci: Mater Electron 28, 7277–7285 (2017). https://doi.org/10.1007/s10854-017-6412-x

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