Skip to main content
SpringerLink
Log in

Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

The impact behavior of solder joints was studied using three different high-velocity impact tests: the U-notch Charpy impact test, the no-notch Charpy impact test, and a laboratory-designed drop test. The solder joints were made of five solder alloys, Sn-37Pb, Sn-3.8Ag-0.7Cu, Sn-2.0Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and Sn-0.7Ag-0.7Cu (in wt.%), in which the traditional Cu/solder/Cu butt joint was used. All three impact tests gave the same trend of the impact behavior of the solder joints, with the Sn-37Pb joints having the highest impact resistance and the Sn-3.8Ag-0.7Cu joints having the lowest impact resistance. For the lead-free joints, the Sn-1.0Ag-0.7Cu joints had better impact resistance than the Sn-2.0Ag-0.7Cu joints, and the Sn-2.0Ag-0.7Cu joints better than the Sn-0.7Ag-0.7Cu joints. The impact behavior was correlated well to the fracture morphologies observed by scanning electron microscopy (SEM). Comparison of the three tests showed that the no-notch Charpy impact test is a promising method for evaluating the drop performance of solder joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. W. Liu and N.-C. Lee, JOM 59, 26 (2007).

    Article  CAS  Google Scholar 

  2. D. Suh, D.W. Kim, P. Liu, H. Kima, J.A. Weninger, C.M. Kumar, A. Prasad, B.W. Grimsley, and H.B. Tejada, Mater. Sci. Eng. A 460–461, 595 (2007).

    Google Scholar 

  3. Y.-S. Lai, P.-F. Yang, and C.-L. Yeh, Microelectron. Reliab. 46, 645 (2006).

    Article  CAS  Google Scholar 

  4. T. You, Y. Kim, J. Kim, J. Lee, B. Jung, J. Moon, and H. Choe, J. Electron. Mater. 38, 410 (2009).

    Article  CAS  ADS  Google Scholar 

  5. Y.L. Huang, K.L. Lin, and D.S. Liu, J. Mater. Res. 23, 1057 (2008).

    Article  CAS  ADS  Google Scholar 

  6. S. Jeon, S. Hyun, H.-J. Lee, J.-W. Kim, S.-S. Ha, J.-W. Yoon, S.-B. Jung, and H.-J. Lee, Microelectron. Eng. 85, 1967 (2008).

    Article  CAS  Google Scholar 

  7. E.H. Wong, S.K.W. Seah, C.S. Selvanayagam, R. Rajoo, W.D. Van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, M. Leoni, L.C. Tan, Y.-S. Lai, and C.-L. Yeh, J. Electron. Mater. 38, 884 (2009).

    Article  CAS  ADS  Google Scholar 

  8. J. Varghese and A. Dasgupta, Microelectron. Reliab. 47, 93 (2007).

    Article  Google Scholar 

  9. K. Lambrinou, W. Maurissen, P. Limaye, B. Vandevelde, B. Verlinden, and I. De Wolf, J. Electron. Mater. 38, 1881 (2009).

    Article  CAS  ADS  Google Scholar 

  10. Y. Xu, S. Ou, K.N. Tu, M.O. Alam, and Y.C. Chan, J. Mater. Res. 23, 1482 (2008).

    Article  CAS  ADS  Google Scholar 

  11. F. Song, S.W. Ricky Lee, K. Newman, S. Clark, and B. Sykes, IEEE 2006 9th Electron. Pack. Technol. Conf., pp. 450– 458.

  12. D.-S. Liu, C.-Y. Kuo, C.-L. Hsu, G.-S. Shen, Y.-R. Chen, and K.-C. Lo, Mater. Sci. Eng. A 494, 196 (2008).

    Article  Google Scholar 

  13. T. Kobayashi, A. Lee, and K.N. Subramanian, J. Electron. Mater. 38, 2659 (2009).

    Article  CAS  ADS  Google Scholar 

  14. E.H. Wong, S.K.W. Seah, and V.P.W. Shim, Microelectron. Reliab. 48, 1747 (2008).

    Article  CAS  Google Scholar 

  15. P. Kumar, I. Dutta, V. Sarihan, D.R. Frear, and M. Renavikar, ITHERM 2008 11th Intersociety Conf., pp. 660–667.

  16. W. Peng and M.E. Marques, J. Electron. Mater. 36, 1679 (2007).

    Article  CAS  ADS  Google Scholar 

  17. P. Limaye, W. Maurissen, K. Lambrinou, F. Duflos, B. Vandevelde, B. Allaert, J. Hillaert, D. Vandepitte, and B. Verlinden, IEEE 2007 9th Electron. Pack. Technol. Conf., IMEC, Leuven, pp. 140–151.

  18. W. Liu, P. Bachorik, and N.-C. Lee, IEEE 2008 Electron. Comp. Technol. Conf., pp. 452–458.

Download references

Author information

Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing, 100124, People’s Republic of China

    Ning Zhang, Yaowu Shi & Fu Guo

  2. Department of Chemical and Materials Engineering, University of Kentucky, Lexington, KY, 40506, USA

    Ning Zhang & Fuqian Yang

Authors
  1. Ning Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yaowu Shi
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Fu Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Fuqian Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Ning Zhang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhang, N., Shi, Y., Guo, F. et al. Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests. J. Electron. Mater. 39, 2536–2543 (2010). https://doi.org/10.1007/s11664-010-1369-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-010-1369-z

Keywords

Search

Navigation