Skip to main content

Advertisement

SpringerLink
Log in

Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

To optimize the mechanical properties of low-Ag lead-free solder, different amount of Bi element was added into the Sn–1.0Ag–0.5Cu (SAC105) to form SAC105-xBi (0 ≤ x ≤ 4) solder alloy. The microstructural evolution and shear fracture of SAC105-xBi solder joints were systematically investigated to clarify the failure mechanism after reflow and after 175 °C aging compared to SAC305. It was found that Bi element could provide solution strengthening and second-phase strengthening in the low-Ag SAC solder joints depending on the amount of added Bi element. The shear strength after reflow increased from 34.79 to 70.16 MPa with the increase of Bi addition from x = 0.0 to x = 4.0, while that after aging at 175 °C for 168 h increased from 28.97 MPa (x = 0.0) to 55.02 MPa (x = 4.0). The thickness of IMC decreased with the addition of Bi, and excessive Bi would precipitate in the matrix when the Bi content reached 2 wt% or even form brittle Bi barrier layer after 4 wt% addition. During shear tests, three kinds of fracture mode including ductile fracture, quasi-cleavage fracture, and cleavage brittle fracture were observed, and three kinds of failure position including solder matrix, Cu6Sn5/solder interface, and Cu3Sn/Cu interface were revealed. The failure mechanism of different solder joints was closely related to the coupling effects among the Bi amount in the matrix, the thicknesses of IMC, and the status of Kirkendall voids, which significantly affected the reliability of SAC solder joints. Finally, SAC105-1.0Bi solder alloy was considered having the most suitable Bi addition with anticipated comprehensive properties compared with SAC305.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  1. S.Y. Chang, L.C. Tsao, M.W. Wu, C.W. Chen, J. Mater. Sci. Mater. Electron. 23, 100 (2012)

    Article  CAS  Google Scholar 

  2. Z. Gao, J. Cao, H.M. Muzammal, C. Wang, H. Sun, C. Dong, H. Ma, Y. Wang, Mater. Chem. Phys. 242, 122540 (2020)

    Article  CAS  Google Scholar 

  3. Z. Gao, H. Sun, J. Cao, C. Wang, M.M. Hussain, C. Xiao, Y. Chen, C. Dong, Y. Wang, H. Ma, Mater. Chem. Phys. 254, 123490 (2020)

    Article  CAS  Google Scholar 

  4. L.Y. Gao, X.W. Cui, F.F. Tian, Z.Q. Liu, J. Electron. Mater. 49, 6223 (2020)

    Article  CAS  Google Scholar 

  5. N. Saud, A. Jalar, J. Mater. Sci. Mater. Electron. 21, 1083 (2010)

    Article  CAS  Google Scholar 

  6. O. Krammer, T. Garami, B. Horváth, T. Hurtony, B. Medgyes, L. Jakab, J. Alloys Compd. 634, 156 (2015)

    Article  CAS  Google Scholar 

  7. Y. Liu, J. Meerwijk, L. Luo, H. Zhang, F. Sun, C.A. Yuan, G. Zhang, J. Mater. Sci. Mater. Electron. 25, 4954 (2014)

    Article  CAS  Google Scholar 

  8. F. Ochoa, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1414 (2003)

    Article  CAS  Google Scholar 

  9. D.A.A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Badruddin, F.X. Che, Mater. Sci. Eng. A 551, 160 (2012)

    Article  CAS  Google Scholar 

  10. P. Deghaid Pereira, J. Eduardo, Spinelli, A. Garcia, Mater. Des. 45, 377 (2013)

    Article  Google Scholar 

  11. Y.M. Leong, A.S.M.A. Haseeb, H. Nishikawa, O. Mokhtari, J. Mater. Sci. Mater. Electron. 30, 11914 (2019)

    Article  CAS  Google Scholar 

  12. K. Kanlayasiri, K. Sukpimai, J. Alloys Compd. 668, 169 (2016)

    Article  CAS  Google Scholar 

  13. A.A. El-Daly, A.M. El-Taher, T.R. Dalloul, J. Alloys Compd. 587, 32 (2014)

    Article  CAS  Google Scholar 

  14. A.A. El-Daly, A.M. El-Taher, S. Gouda, J. Alloys Compd. 627, 268 (2015)

    Article  CAS  Google Scholar 

  15. D.A. Shnawah, M.F.M. Sabri, I.A. Badruddin, S.B.M. Said, T. Ariga, F.X. Che, J. Electron. Mater. 42, 470 (2013)

    Article  CAS  Google Scholar 

  16. D.A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Badruddin, F.X. Che, J. Electron. Mater. 41, 2631 (2012)

    Article  CAS  Google Scholar 

  17. Y. Liu, F. Sun, Y. Liu, J. Mater. Sci. Mater. Electron. 24, 290 (2013)

    Article  CAS  Google Scholar 

  18. Y. Liu, F. Sun, H. Zhang, P. Zou, J. Mater. Sci. Mater. Electron. 23, 1705 (2012)

    Article  CAS  Google Scholar 

  19. P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, Scripta Mater. 59, 317 (2008)

    Article  CAS  Google Scholar 

  20. P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, Scripta Mater. 58, 409 (2008)

    Article  CAS  Google Scholar 

  21. P.J. Shang, Z.Q. Liu, X.Y. Pang, D.X. Li, J.K. Shang, Acta Mater. 57, 4697 (2009)

    Article  CAS  Google Scholar 

  22. Z.Q. Liu, P.J. Shang, F. Tan, D. Li, Microsc. Microanal. 19, 105 (2013)

    Article  CAS  Google Scholar 

  23. X.Y. Pang, Z.Q. Liu, S.Q. Wang, J.K. Shang, J. Mater. Sci. Technol. 26, 1057 (2010)

    Article  CAS  Google Scholar 

  24. X.Y. Pang, Z.Q. Liu, S.Q. Wang, J.K. Shang, Microelectron. Reliab. 51, 2330 (2011)

    Article  CAS  Google Scholar 

  25. X.Y. Pang, P.J. Shang, S.Q. Wang, Z.Q. Liu, J.K. Shang, J. Electron. Mater. 39, 1277 (2010)

    Article  CAS  Google Scholar 

  26. Y. Chen, Y. Gao, Z.Q. Liu, H. Zhang, T. Sugahara, S. Nagao, K. Suganuma, 18th Int. Conf. Electron. Packag. Technol. ICEPT 2017 464 (2017)

  27. Q.K. Zhang, H.F. Zou, Z.F. Zhang, J. Electron. Mater. 38, 852 (2009)

    Article  CAS  Google Scholar 

  28. M.H. Braga, J. Vizdal, A. Kroupa, J. Ferreira, D. Soares, L.F. Malheiros, Calphad Comput. Coupling Phase Diagrams Thermochem. 31, 468 (2007)

    Article  CAS  Google Scholar 

  29. X. Hu, T. Xu, L.M. Keer, Y. Li, X. Jiang, Mater. Sci. Eng. A 673, 167 (2016)

    Article  CAS  Google Scholar 

  30. J.F. Li, S.H. Mannan, M.P. Clode, D.C. Whalley, D.A. Hutt, Acta Mater. 54, 2907 (2006)

    Article  CAS  Google Scholar 

  31. X. Hua, Y. Li, Z. Min, J. Alloys Compd. 582, 341 (2014)

    Article  Google Scholar 

  32. M.H. Mahdavifard, M.F.M. Sabri, S.M. Said, S. Rozali, Microelectron. Eng. 208, 29 (2019)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

This work was partially supported by the National Key R&D Program of China (No. 2017YFB0305700).

Author information

Authors and Affiliations

  1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    Yinbo Chen, Zhi-Chao Meng & Zhi-Quan Liu

  2. School of Materials Science and Engineering, University of Science and Technology of China, Shenyang, 110016, China

    Yinbo Chen & Zhi-Chao Meng

  3. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China

    Li-Yin Gao & Zhi-Quan Liu

Authors
  1. Yinbo Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Zhi-Chao Meng
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Li-Yin Gao
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Zhi-Quan Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Zhi-Quan Liu.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Chen, Y., Meng, ZC., Gao, LY. et al. Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints. J Mater Sci: Mater Electron 32, 2172–2186 (2021). https://doi.org/10.1007/s10854-020-04982-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-020-04982-4

Search

Navigation