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Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

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Abstract

The shear strength behavior and microstructural effects after aging for 100 h and 1,000 h at 150°C are reported for near-eutectic Sn-Ag-Cu (SAC) solder joints (joining to Cu) made from Sn-3.5Ag (wt.%) and a set of SAC alloys (including Co- and Fe-modified SAC alloys). All joints in the as-soldered and 100-h aged condition experienced shear failure in a ductile manner by either uniform shear of the solder matrix (in the strongest solders) or by a more localized shear of the solder matrix adjacent to the Cu6Sn5 interfacial layer, consistent with other observations. After 1,000 h of aging, a level of embrittlement of the Cu3Sn/Cu interface can be detected in some solder joints made with all of the SAC alloys and with Sn-3.5Ag, which can lead to partial debonding during shear testing. However, only ductile failure was observed in all solder joints made from the Co- and Fe-modified SAC alloys after aging for 1,000 h. Thus, the strategy of modifying a strong (high Cu content) SAC solder alloy with a substitutional alloy addition for Cu seems to be effective for producing a solder joint that retains both strength and ductility for extended isothermal aging at high temperatures.

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  1. Ames Laboratory (USDOE), Iowa State University, 50011, Ames, IA

    I. E. Anderson & J. L. Harringa

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  1. I. E. Anderson
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  2. J. L. Harringa
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Anderson, I.E., Harringa, J.L. Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength. J. Electron. Mater. 33, 1485–1496 (2004). https://doi.org/10.1007/s11664-004-0090-1

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  • DOI: https://doi.org/10.1007/s11664-004-0090-1

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