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Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5Zn–0.4 wt% Cu Pb-free solder alloy

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Abstract

The role of incorporation of the 0.5 and 1.0 wt% GO with the Sn–6.5Zn–0.4 wt% Cu has been researched. The effect of GO additions on the nucleation rate Φ during the solidification process of examined alloys was investigated. The microstructure characteristics, thermal behavior, and tensile stress–strain variables were examined. FE-SEM examinations revealed the existence of Zn8Cu5 intermetallic compounds IMCs. The grain size of β-Sn and the α-Zn needles were remarkably refined after incorporating the GO nanosheets (GONs) in the solder alloys matrix. GONs have been sacrificed to serve as germinating seeds for nucleation embryos during the crystallization. The sophisticated microstructure caused the enhancement of the tensile parameters (i.e., Ys, UTS, and El%). Eventually, the activation energy (Q) and stress exponent (n) have been computed to estimate the deformation mechanism of the examined alloys. Based on the Q values of SZC-0.0GO and SZC-0.5GO solder alloys that equal 62.0 and 71.1 kJ/mol, respectively. The dislocations processes of the pipe diffusion mechanism were predominant. Moreover, increasing the GO content led to increasing the Q value of SZC-1.0GO to 84.8 kJ/mol, which led to converting the pipe diffusion mechanism into a lattice diffusion mechanism.

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Acknowledgements

This work was supported by the Deanship of Scientific Research (DSR), King Abdulaziz University, Jeddah, under Grant No. (D-390-662-1441). The authors, therefore, gratefully acknowledge the DSR technical and financial support.

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Authors and Affiliations

  1. Physics Department, College of Science & Arts, King Abdul Aziz University, Rabigh, Jeddah, Saudi Arabia

    A. N. Fouda & E. A. Eid

  2. Physics Department, Faculty of Science, Suez Canal University, Ismailia, 41522, Egypt

    A. N. Fouda

  3. Department of Basic Science, Higher Technological Institute, 10th of Ramadan City, 44629, Egypt

    E. A. Eid

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  1. A. N. Fouda
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Correspondence to A. N. Fouda or E. A. Eid.

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Fouda, A.N., Eid, E.A. Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5Zn–0.4 wt% Cu Pb-free solder alloy. J Mater Sci: Mater Electron 33, 522–540 (2022). https://doi.org/10.1007/s10854-021-07324-0

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