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About this book
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity.
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.
MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
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Keywords
Table of contents (31 chapters)
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Front Matter
Editors and Affiliations
Bibliographic Information
Book Title: MCM C/Mixed Technologies and Thick Film Sensors
Editors: W. Kinzy Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui
Series Title: NATO Science Partnership Subseries: 3
DOI: https://doi.org/10.1007/978-94-011-0079-3
Publisher: Springer Dordrecht
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media Dordrecht 1995
Hardcover ISBN: 978-0-7923-3460-6Published: 30 April 1995
Softcover ISBN: 978-94-010-4039-6Published: 13 November 2012
eBook ISBN: 978-94-011-0079-3Published: 06 December 2012
Series ISSN: 1388-6576
Edition Number: 1
Number of Pages: X, 318
Topics: Electronics and Microelectronics, Instrumentation, Circuits and Systems, Electrical Engineering, Optical and Electronic Materials, Characterization and Evaluation of Materials, Signal, Image and Speech Processing