Abstract
The Low Temperature Cofired Ceramic (LTCC) technology has been given increased attention over the last years [1]. This is because LTCC has proven to be a viable substrate technology for many applications where low cost and high reliability are required. The major part of these applications are digital circuits operating at moderate speed.
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References
Cicognani, J. et al. “LTCC-An Economical and Industrial Interconnect and Packaging solution for MCM’s”, Proceedings of the 9th European Hybrid Microelectronic Conference, Nice 1993, 150–157.
Vickes, H. “Characterization of Low Temperature Cofired Ceramic Structures for Microwave Applications”, Proceedings of the 30th ISHM-Nordic Conference, Oslo 1992, 229–240.
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© 1995 Springer Science+Business Media Dordrecht
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Johnsson, P., Vaktnäs, C., Billström, N. (1995). High Frequency LTCC Modules. In: Jones, W.K., Kurzweil, K., Harsányi, G., Mergui, S. (eds) MCM C/Mixed Technologies and Thick Film Sensors. NATO ASI Series, vol 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0079-3_3
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DOI: https://doi.org/10.1007/978-94-011-0079-3_3
Publisher Name: Springer, Dordrecht
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