Abstract
The reliability of the 3-D interconnection has been proven by several companies [1, 2] for applications designed around the stacking of memories. The particularity of the approach initiated in 1989 at Thomson is that it was based on the concept of dual-purpose technologies. In fact, the French Ministry of Defence recommended the development of techniques that could be used for consumer products as well as ruggedized products in order to attain the level of military standards. It is a well-known fact that the inverse, that is, the transition from a military product to a mass-produced civil product, is practically impossible on account of cost.
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© 1995 Springer Science+Business Media Dordrecht
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Val, C.M. (1995). 3-D Interconnection Microsystems Applications. In: Jones, W.K., Kurzweil, K., Harsányi, G., Mergui, S. (eds) MCM C/Mixed Technologies and Thick Film Sensors. NATO ASI Series, vol 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0079-3_1
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DOI: https://doi.org/10.1007/978-94-011-0079-3_1
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