Multi-Chip Module Applications in Satellite Communications

Abstract

The use of Electronics Technologies in Space pose interesting but manageable challenges and significant opportunities for the use of Multi-Chip Modules (MCMs) and low cost packaging technologies — whose properties offer significant advantages in space and locations involving exposure to radiation. Communication via satellites located in space require performance at high frequencies in the microwave range (delivered by silicon or GaAs MMICs- monolithic microwave integrated circuits — and controlled by MCMs), hardware technologies which are compact and lightweight and will withstand the acceleration forces during launch and manoeuvre into orbit, semiconductor device and packaging and interconnection technologies which will withstand prolonged exposure to radiation, and an extremely high reliability because of the high telecommunications traffic carried and the enormous cost of repair if a failure should occur.